カテゴリー： 世界, IT/電子, Research Dive

世界の3Dセンサー市場2022年-2031年：種類別（イメージセンサー、加速度センサー、位置センサー、その他）、技術別（構造化ライト、飛行時間、立体視、超音波、その他）、接続別（無線、有線）、最終用途別（家電、医療、航空宇宙＆防衛、自動車、その他）

【英語タイトル】3D Sensor Market by Type (Image Sensor, Accelerometer Sensor, Position Sensor, and Others), Technology (Structured Light, Time of Flight, Stereoscopic Vision, Ultrasound, and Others), Connectivity (Wireless and Wired), and End Use (Consumer Electronics, Healthcare, Aerospace & Defense, Automotive, and Others): Global Opportunity Analysis and Industry Forecast, 2022-2031

Research Diveが出版した調査資料（RDV23MA030）・商品コード：RDV23MA030
・発行会社（調査会社）：Research Dive
・発行日：2022年12月26日
・ページ数：250
・レポート言語：英語
・レポート形式：PDF
・納品方法：Eメール
・調査対象地域：グローバル
・産業分野：半導体＆電子
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❖ レポートの概要 ❖

Research Dive社の本調査レポートでは、世界の3Dセンサー市場規模が2021年17,607.90百万ドルから2031年には56,992.30百万ドルに達し、年平均13.0%成長すると予測しています。本レポートは、3Dセンサーの世界市場について調査を行い、調査手法、調査範囲、エグゼクティブサマリー、市場概要、種類別（イメージセンサー、加速度センサー、位置センサー、その他）分析、技術別（構造化ライト、飛行時間、立体視、超音波、その他）分析、接続別（無線、有線）分析、最終用途別（家電、医療、航空宇宙＆防衛、自動車、その他）分析、地域別（北米、ヨーロッパ、アジア太平洋、中南米・中東・アフリカ）分析、競争状況などの項目をまとめています。なお、企業情報には、Infineon Technologies AG, SAMSUNG, LMI TECHNOLOGIES INC., COGNEX CORPORATION, Microchip Technology Inc., Occipital, Inc., Qualcomm Technologies, Inc., KEYENCE CORPORATION, OmniVision Technologies, Inc., and Sony Depthsensing Solutions SA/NV.などが含まれています。
・調査手法
・調査範囲
・エグゼクティブサマリー
・市場概要
・世界の3Dセンサー市場規模：種類別
- イメージセンサーの市場規模
- 加速度センサーの市場規模
- 位置センサーの市場規模
- その他種類の市場規模
・世界の3Dセンサー市場規模：技術別
- 構造化ライトの市場規模
- 飛行時間の市場規模
- 立体視の市場規模
- 超音波の市場規模
- その他技術の市場規模
・世界の3Dセンサー市場規模：接続別
- 無線3Dセンサーの市場規模
- 有線3Dセンサーの市場規模
・世界の3Dセンサー市場規模：最終用途別
- 家電における市場規模
- 医療における市場規模
- 航空宇宙＆防衛における市場規模
- 自動車における市場規模
- その他最終用途における市場規模
・世界の3Dセンサー市場規模：地域別
- 北米の3Dセンサー市場規模
- ヨーロッパの3Dセンサー市場規模
- アジア太平洋の3Dセンサー市場規模
- 中南米の3Dセンサー市場規模
- 中東/アフリカの3Dセンサー市場規模
・競争状況
・企業情報

According to Research Dive analysis, the global 3D sensor market is anticipated to generate revenue of $ 56,992.30 million by 2031, increasing from $ 17,607.90 million in 2021, at a CAGR of 13.0%.

COVID-19 Impact on Global 3D Sensor Market:
To contain global transmission of coronavirus, many government authorities imposed strict lockdowns, travel & transportation restrictions, and prohibited social gatherings, globally. Several companies in the 3D sensors market had to either pause their technology development activities or shut down their manufacturing capacities due to a shortage of labor and the non-availability of raw materials. Therefore, the supply of 3D sensor devices such as drones, and cameras had reduced considerably. The healthcare sector experienced tremendous growth opportunities amid the growing prevalence of the COVID-19 pandemic. The demand for the latest technology and its integration with medical devices have increased during the pandemic. Cameras with installed 3D sensing technology have proved to be very useful in regularly monitoring elderly people and their health when they were not able to visit and have proper medical treatment in hospitals during the pandemic. Such factors are responsible for the growth of the 3D sensors market.
Various initiatives taken by companies to support 3D sensor projects are helping society to recover from the pandemic. For instance, in March 2021, the automated queue management system (AQMS) at Kuala Lumpur International Airport (KLIA) began utilizing new 3D sensor technology to cut wait time to under 10 minutes.

3D Sensor Market Analysis:
The 3D sensor market growth is expected to increase owing to the growing demand for advanced sensing technology in various industries, including gaming, consumer electronics, smartphones & tablets, and security & surveillance cameras. The market for 3D sensors is also anticipated to be driven by the replacement of 2D technology with 3D technology and its increasing application in the media and retail industries. Technology advancements, including 3D motion detection, gesture recognition, and interior navigation are also anticipated to drive the market expansion.
The high initial cost of installing 3D sensors in electronic devices like cameras is likely to restrain the market growth during the forecast period. While 3D imaging technologies undoubtedly offer more information than 2D systems, they are also significantly more complex in assimilating gathered information. Calibration and comparing data to a calibrated standard, which typically takes a lot more information than planar calibration, are the key issues with 3D sensing technology. Such factors are expected to hamper the market growth in the next few years.
The 3D sensor plays a significant role in the expansion of the semiconductor industry and has attractive properties, including high efficiency, improved reliability, and cost-effectiveness. Earlier, 3D depth sensing technology was majorly used in the gaming industry. But now the technology’s range of applications has expanded to include, 3D imaging and detection in the automobile and healthcare industries. The use of 3D sensors to provide 4K and Ultra HD vision in TVs and PCs, together with mapping, augmented reality, and enhanced biometric sensing in mobile phones, has drastically increased in the consumer electronics field. Also, the use of 3D sensing technology has increased in the robotics sector owing to the rise in the need for virtualized solutions.
By type, the image sensor segment is predicted to witness the fastest growth rate during the forecast period, majorly due to the high demand for image sensing in the healthcare industry for visualizing vitals of the patients.

By technology, the structured light segment is projected to be the most dominant by 2031, due to an increase in use of 3D sensors in structured light in the automotive industry.

By connectivity, the wireless segment is expected to be the most dominant segment in 2031, due to the increase in use of 3D sensors in the automotive industry.

By end use, the consumer electronics segment is anticipated to be the most dominant segment by 2031, due to an increase in the global population’s demand for high-tech PCs, laptops, cellphones, cameras, and others, which is anticipated to drive the 3D sensor market expansion.
By region, the Asia-Pacific 3D sensor market is anticipated to rise at a significant rate during the forecast years. The growth is to be a result of various government initiatives in the region, such as those of the National Robotics Program in Singapore.
Companies involved in the global 3D sensor market are Infineon Technologies AG, SAMSUNG, LMI TECHNOLOGIES INC., COGNEX CORPORATION, Microchip Technology Inc., Occipital, Inc., Qualcomm Technologies, Inc., KEYENCE CORPORATION, OmniVision Technologies, Inc., and Sony Depthsensing Solutions SA/NV.

グローバル市場調査レポート販売サイトのwww.marketreport.jpです。

❖ レポートの目次 ❖

1.Research Methodology

1.1.Desk Research
1.2.Real time insights and validation
1.3.Forecast model
1.4.Assumptions and forecast parameters
1.5.Market size estimation

1.5.1.Top-down approach
1.5.2.Bottom-up approach

2.Report Scope

2.1.Market definition
2.2.Key objectives of the study
2.3.Report overview
2.4.Market segmentation
2.5.Overview of the impact of COVID-19 on global 3D Sensors market

3.Executive Summary

4.Market Overview

4.1.Introduction
4.2.Growth impact forces

4.2.1.Drivers
4.2.2.Restraints
4.2.3.Opportunities

4.3.Market value chain analysis

4.3.1.List of raw material suppliers
4.3.2.List of manufacturers
4.3.3.List of distributors

4.4.Innovation & sustainability matrices

4.4.1.Technology matrix
4.4.2.Regulatory matrix

4.5.Porter’s five forces analysis

4.5.1.Bargaining power of suppliers
4.5.2.Bargaining power of consumers
4.5.3.Threat of substitutes
4.5.4.Threat of new entrants
4.5.5.Competitive rivalry intensity

4.6.PESTLE analysis

4.6.1.Political
4.6.2.Economical
4.6.3.Social
4.6.4.Technological
4.6.5.Environmental

4.7.Impact of COVID-19 on 3D Sensors market

4.7.1.Pre-covid market scenario
4.7.2.Post-covid market scenario

5.3D Sensors Market, by Type

5.1.Overview

5.1.1.Market size and forecast, by Type

5.2.Image Sensors

5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region, 2021-2031
5.2.3.Market share analysis, by country 2021- 2031

5.3.Accelerometer Sensors

5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region, 2021-2031
5.3.3.Market share analysis, by country 2021- 2031

5.4.Position Sensors

5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region, 2021-2031
5.4.3.Market share analysis, by country 2021- 2031

5.5.Others

5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region, 2021-2031
5.5.3.Market share analysis, by country 2021- 2031

5.6.Research Dive Exclusive Insights

5.6.1.Market attractiveness
5.6.2.Competition heatmap

6.3D Sensors Market, by Technology

6.1.Overview

6.1.1.Market size and forecast, by Technology

6.2.Structured Light

6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region, 2021-2031
6.2.3.Market share analysis, by country 2021- 2031

6.3.Time of Flight

6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region, 2021-2031
6.3.3.Market share analysis, by country 2021- 2031

6.4.Stereoscopic Vision

6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region, 2021-2031
6.4.3.Market share analysis, by country 2021- 2031

6.5.Ultrasound

6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region, 2021-2031
6.5.3.Market share analysis, by country 2021- 2031

6.6.Others

6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region, 2021-2031
6.6.3.Market share analysis, by country 2021- 2031

6.7.Research Dive Exclusive Insights

6.7.1.Market attractiveness
6.7.2.Competition heatmap

7.3D Sensors Market, by Connectivity

7.1.Overview

7.1.1.Market size and forecast, by Connectivity

7.2.Wireless

7.2.1.Key market trends, growth factors, and opportunities
7.2.2.Market size and forecast, by region, 2021-2031
7.2.3.Market share analysis, by country 2021- 2031

7.3.Wired

7.3.1.Key market trends, growth factors, and opportunities
7.3.2.Market size and forecast, by region, 2021-2031
7.3.3.Market share analysis, by country 2021- 2031

7.4.Research Dive Exclusive Insights

7.4.1.Market attractiveness
7.4.2.Competition heatmap

8.3D Sensors Market, by End Use

8.1.Overview

8.1.1.Market size and forecast, by Technology

8.2.Consumer Electronics

8.2.1.Key market trends, growth factors, and opportunities
8.2.2.Market size and forecast, by region, 2021-2031
8.2.3.Market share analysis, by country 2021- 2031

8.3.Healthcare

8.3.1.Key market trends, growth factors, and opportunities
8.3.2.Market size and forecast, by region, 2021-2031
8.3.3.Market share analysis, by country 2021- 2031

8.4.Aerospace & Defense

8.4.1.Key market trends, growth factors, and opportunities
8.4.2.Market size and forecast, by region, 2021-2031
8.4.3.Market share analysis, by country 2021- 2031

8.5.Automotive

8.5.1.Key market trends, growth factors, and opportunities
8.5.2.Market size and forecast, by region, 2021-2031
8.5.3.Market share analysis, by country 2021- 2031

8.6.Others

8.6.1.Key market trends, growth factors, and opportunities
8.6.2.Market size and forecast, by region, 2021-2031
8.6.3.Market share analysis, by country 2021- 2031

8.7.Research Dive Exclusive Insights

8.7.1.Market attractiveness
8.7.2.Competition heatmap

9.3D Sensors Market, by Region

9.1.North America

9.1.1.U.S.

9.1.1.1.Market size analysis, by Type
9.1.1.2.Market size analysis, by Technology
9.1.1.3.Market size analysis, by Connectivity
9.1.1.4.Market size analysis, by End use

9.1.2.Canada

9.1.2.1.Market size analysis, by Type
9.1.2.2.Market size analysis, by Technology
9.1.2.3.Market size analysis, by Connectivity
9.1.2.4.Market size analysis, by End use

9.1.3.Mexico

9.1.3.1.Market size analysis, by Type
9.1.3.2.Market size analysis, by Technology
9.1.3.3.Market size analysis, by Connectivity
9.1.3.4.Market size analysis, by End use

9.1.4.Research Dive Exclusive Insights

9.1.4.1.Market attractiveness
9.1.4.2.Competition heatmap

9.2.Europe

9.2.1.Germany

9.2.1.1.Market size analysis, by Type
9.2.1.2.Market size analysis, by Technology
9.2.1.3.Market size analysis, by Connectivity
9.2.1.4.Market size analysis, by End use

9.2.2.UK

9.2.2.1.Market size analysis, by Type
9.2.2.2.Market size analysis, by Technology
9.2.2.3.Market size analysis, by Connectivity
9.2.2.4.Market size analysis, by End use

9.2.3.France

9.2.3.1.Market size analysis, by Type
9.2.3.2.Market size analysis, by Technology
9.2.3.3.Market size analysis, by Connectivity
9.2.3.4.Market size analysis, by End use

9.2.4.Spain

9.2.4.1.Market size analysis, by Type
9.2.4.2.Market size analysis, by Technology
9.2.4.3.Market size analysis, by Connectivity
9.2.4.4.Market size analysis, by End use

9.2.5.Italy

9.2.5.1.Market size analysis, by Type
9.2.5.2.Market size analysis, by Technology
9.2.5.3.Market size analysis, by Connectivity
9.2.5.4.Market size analysis, by End use

9.2.6.Rest of Europe

9.2.6.1.Market size analysis, by Type
9.2.6.2.Market size analysis, by Technology
9.2.6.3.Market size analysis, by Connectivity
9.2.6.4.Market size analysis, by End use

9.2.7.Research Dive Exclusive Insights

9.2.7.1.Market attractiveness
9.2.7.2.Competition heatmap

9.3.Asia-Pacific

9.3.1.China

9.3.1.1.Market size analysis, by Type
9.3.1.2.Market size analysis, by Technology
9.3.1.3.Market size analysis, by Connectivity
9.3.1.4.Market size analysis, by End use

9.3.2.Japan

9.3.2.1.Market size analysis, by Type
9.3.2.2.Market size analysis, by Technology
9.3.2.3.Market size analysis, by Connectivity
9.3.2.4.Market size analysis, by End use

9.3.3.India

9.3.3.1.Market size analysis, by Type
9.3.3.2.Market size analysis, by Technology
9.3.3.3.Market size analysis, by Connectivity
9.3.3.4.Market size analysis, by End use

9.3.4.Australia

9.3.4.1.Market size analysis, by Type
9.3.4.2.Market size analysis, by Technology
9.3.4.3.Market size analysis, by Connectivity
9.3.4.4.Market size analysis, by End use

9.3.5.South Korea

9.3.5.1.Market size analysis, by Type
9.3.5.2.Market size analysis, by Technology
9.3.5.3.Market size analysis, by Connectivity
9.3.5.4.Market size analysis, by End use

9.3.6.Rest of Asia-Pacific

9.3.6.1.Market size analysis, by Type
9.3.6.2.Market size analysis, by Technology
9.3.6.3.Market size analysis, by Connectivity
9.3.6.4.Market size analysis, by End use

9.3.7.Research Dive Exclusive Insights

9.3.7.1.Market attractiveness
9.3.7.2.Competition heatmap

9.4.LAMEA

9.4.1.Brazil

9.4.1.1.Market size analysis, by Type
9.4.1.2.Market size analysis, by Technology
9.4.1.3.Market size analysis, by Connectivity
9.4.1.4.Market size analysis, by End use

9.4.2.Saudi Arabia

9.4.2.1.Market size analysis, by Type
9.4.2.2.Market size analysis, by Technology
9.4.2.3.Market size analysis, by Connectivity
9.4.2.4.Market size analysis, by End use

9.4.3.UAE

9.4.3.1.Market size analysis, by Type
9.4.3.2.Market size analysis, by Technology
9.4.3.3.Market size analysis, by Connectivity
9.4.3.4.Market size analysis, by End use

9.4.4.South Africa

9.4.4.1.Market size analysis, by Type
9.4.4.2.Market size analysis, by Technology
9.4.4.3.Market size analysis, by Connectivity
9.4.4.4.Market size analysis, by End use

9.4.5.Rest of LAMEA

9.4.5.1.Market size analysis, by Type
9.4.5.2.Market size analysis, by Technology
9.4.5.3.Market size analysis, by Connectivity
9.4.5.4.Market size analysis, by End use

9.4.6.Research Dive Exclusive Insights

9.4.6.1.Market attractiveness
9.4.6.2.Competition heatmap

10.Competitive Landscape

10.1.Top winning strategies, 2021

10.1.1.By strategy
10.1.2.By year
10.2.Strategic overview
10.3.Market share analysis, 2021

11.Company Profiles

11.1.PMD Technologies AG

11.1.1.Overview
11.1.2.Business segments
11.1.3.Product portfolio
11.1.4.Financial performance
11.1.5.Recent developments
11.1.6.SWOT analysis

11.2.Infineon Technologies AG

11.2.1.Overview
11.2.2.Business segments
11.2.3.Product portfolio
11.2.4.Financial performance
11.2.5.Recent developments
11.2.6.SWOT analysis

11.3.SAMSUNG

11.3.1.Overview
11.3.2.Business segments
11.3.3.Product portfolio
11.3.4.Financial performance
11.3.5.Recent developments
11.3.6.SWOT analysis

11.4.LMI TECHNOLOGIES INC.

11.4.1.Overview
11.4.2.Business segments
11.4.3.Product portfolio
11.4.4.Financial performance
11.4.5.Recent developments
11.4.6.SWOT analysis

11.5.COGNEX CORPORATION

11.5.1.Overview
11.5.2.Business segments
11.5.3.Product portfolio
11.5.4.Financial performance
11.5.5.Recent developments
11.5.6.SWOT analysis

11.6.Microchip Technology Inc.

11.6.1.Overview
11.6.2.Business segments
11.6.3.Product portfolio
11.6.4.Financial performance
11.6.5.Recent developments
11.6.6.SWOT analysis

11.7.Occipital, Inc.

11.7.1.Overview
11.7.2.Business segments
11.7.3.Product portfolio
11.7.4.Financial performance
11.7.5.Recent developments
11.7.6.SWOT analysis

11.8.Qualcomm Technologies, Inc.

11.8.1.Overview
11.8.2.Business segments
11.8.3.Product portfolio
11.8.4.Financial performance
11.8.5.Recent developments
11.8.6.SWOT analysis

11.9.KEYENCE CORPORATION

11.9.1.Overview
11.9.2.Business segments
11.9.3.Product portfolio
11.9.4.Financial performance
11.9.5.Recent developments
11.9.6.SWOT analysis

11.10.OmniVision Technologies, Inc.

11.10.1.Overview
11.10.2.Business segments
11.10.3.Product portfolio
11.10.4.Financial performance
11.10.5.Recent developments
11.10.6.SWOT analysis

12.Appendix

12.1.Parent & peer market analysis
12.2.Premium insights from industry experts
12.3.Related reports



★調査レポート[世界の3Dセンサー市場2022年-2031年：種類別（イメージセンサー、加速度センサー、位置センサー、その他）、技術別（構造化ライト、飛行時間、立体視、超音波、その他）、接続別（無線、有線）、最終用途別（家電、医療、航空宇宙＆防衛、自動車、その他）] (コード：RDV23MA030)販売に関する免責事項を必ずご確認ください。
★調査レポート[世界の3Dセンサー市場2022年-2031年：種類別（イメージセンサー、加速度センサー、位置センサー、その他）、技術別（構造化ライト、飛行時間、立体視、超音波、その他）、接続別（無線、有線）、最終用途別（家電、医療、航空宇宙＆防衛、自動車、その他）]についてメールでお問い合わせ
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