世界の化合物半導体市場予測2023年-2028年

【英語タイトル】Compound Semiconductor Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

IMARCが出版した調査資料(IMARC23AP023)・商品コード:IMARC23AP023
・発行会社(調査会社):IMARC
・発行日:2023年3月2日
・ページ数:145
・レポート言語:英語
・レポート形式:PDF
・納品方法:Eメール
・調査対象地域:グローバル
・産業分野:半導体
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❖ レポートの概要 ❖

IMARC社の本調査レポートでは、2022年に1,122億ドルであった世界の化合物半導体市場規模が、2028年までに1,504億ドルに拡大し、予測期間中にCAGR4.9%で成長すると予想しています。本書は、化合物半導体の世界市場を調査・分析し、序論、範囲・調査手法、エグゼクティブサマリー、イントロダクション、種類別(III-V族化合物半導体、II-VI族化合物半導体、サファイア、IV-IV族化合物半導体、その他)分析、製品別(パワー半導体、トランジスタ、集積回路、ダイオード・レクティファイアー、その他)分析、成膜技術別(化学蒸着、分子線エピタキシー法、水素化物気相エピタキシー法、アンモノーサーマル法、その他)分析、用途別(IT・通信、航空宇宙・防衛、自動車、家電、その他)分析、地域別(北米、アジア太平洋、ヨーロッパ、中南米、中東・アフリカ)分析、SWOT分析、バリューチェーン分析、ポーターズファイブフォース分析、価格分析、競争状況などの項目を整理しています。また、本書には、Infineon Technologies AG、Microchip Technology Inc.、Mitsubishi Electric Corporation、NXP Semiconductors N.V.、onsemi、Qorvo Inc.、Renesas Electronics Corporation、STMicroelectronics、Texas Instruments Incorporated、WIN Semiconductors Corp. and Wolfspeed Inc.などの企業情報が含まれています。
・序論
・範囲・調査手法
・エグゼクティブサマリー
・イントロダクション
・世界の化合物半導体市場規模:種類別
- III-V族化合物半導体の市場規模
- II-VI族化合物半導体の市場規模
- サファイアの市場規模
- IV-IV族化合物半導体の市場規模
- その他の市場規模
・世界の化合物半導体市場規模:製品別
- パワー半導体の市場規模
- トランジスタの市場規模
- 集積回路の市場規模
- ダイオード・レクティファイアーの市場規模
- その他の市場規模
・世界の化合物半導体市場規模:成膜技術別
- 化学蒸着における市場規模
- 分子線エピタキシー法における市場規模
- 水素化物気相エピタキシー法における市場規模
- アンモノーサーマル法における市場規模
- その他における市場規模
・世界の化合物半導体市場規模:用途別
- IT・通信における市場規模
- 航空宇宙・防衛における市場規模
- 自動車における市場規模
- 家電における市場規模
- その他における市場規模
・世界の化合物半導体市場規模:地域別
- 北米の化合物半導体市場規模
- アジア太平洋の化合物半導体市場規模
- ヨーロッパの化合物半導体市場規模
- 中南米の化合物半導体市場規模
- 中東・アフリカの化合物半導体市場規模
・SWOT分析
・バリューチェーン分析
・ポーターズファイブフォース分析
・価格分析
・競争状況

The global compound semiconductor market size reached US$ 112.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 150.4 Billion by 2028, exhibiting a growth rate (CAGR) of 4.9% during 2023-2028.

Semiconductors refer to materials that exhibit electrical conductivity between conductors and insulators. At the same time, compound semiconductors are manufactured from two or more different groups of chemical elements in the periodic table. Zinc sulphide (ZnS), gallium arsenide (GaAs), silicon-germanium (SiGe), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC) and zinc selenide (ZnSe) are some of the common elements used in compound semiconductors. The devices made from compound semiconductors exhibit various unique properties, such as high electron mobility and bandgap, enhanced frequency, better current and voltage holding capacity, temperature resistance, breakdown electric fields, faster operation and greater ability to generate microwave signals. As a result, compound semiconductors are widely used in telecommunications, defense, aerospace, automotive, healthcare, electronics and information technology (IT) industries.

Compound Semiconductor Market Trends:
The increasing product demand in light-emitting diode (LED) applications across the globe is creating a positive outlook for the market growth. Compound semiconductors are widely used to sense and emit different color lights in the form of general lighting and signage displays. Additionally, the significant growth in the electronics industry is also favoring the market growth as it is extensively applied in high-frequency devices, information displays and optical devices. Moreover, the increasing utilization of technologies, such as machine learning (ML), artificial intelligence (AI) and the Internet of Things (IoT) for the manufacturing of compound semiconductors are providing an impetus to the market growth. These technologies assist in monitoring inventory control, enhancing the quality and providing maximum operational efficacy. Furthermore, the rising product demand in the automotive industry in autonomous and electric vehicles is positively impacting the market growth. Other factors, including the increasing product utilization in diagnosis and imaging equipment and surgical instrumentation in the healthcare industry, along with the implementation of various government initiatives to promote the installation of energy-efficient lighting sources, are anticipated to drive the market further toward growth.

Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global compound semiconductor market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type, product, deposition technology and application.

Breakup by Type:
III-V Compound Semiconductor
Gallium Nitride
Gallium Phosphide
Gallium Arsenide
Indium Phosphide
Indium Antimonide
II-VI Compound Semiconductor
Cadmium Selenide
Cadmium Telluride
Zinc Selenide
Sapphire
IV-IV Compound Semiconductor
Others

Breakup by Product:
Power Semiconductor
Transistor
Integrated Circuits
Diodes and Rectifiers
Others

Breakup by Deposition Technology:
Chemical Vapor Deposition
Molecular Beam Epitaxy
Hydride Vapor Phase Epitaxy
Ammonothermal
Atomic Layer Deposition
Others

Breakup by Application:
IT and Telecom
Aerospace and Defense
Automotive
Consumer Electronics
Healthcare
Industrial and Energy and Power

Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Infineon Technologies AG, Microchip Technology Inc., Mitsubishi Electric Corporation, NXP Semiconductors N.V., onsemi, Qorvo Inc., Renesas Electronics Corporation, STMicroelectronics, Texas Instruments Incorporated, WIN Semiconductors Corp. and Wolfspeed Inc.

Key Questions Answered in This Report:
How has the global compound semiconductor market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global compound semiconductor market?
What are the key regional markets?
What is the breakup of the market based on the type?
What is the breakup of the market based on the product?
What is the breakup of the market based on the deposition technology?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global compound semiconductor market and who are the key players?
What is the degree of competition in the industry?

グローバル市場調査レポート販売サイトのwww.marketreport.jpです。

❖ レポートの目次 ❖

1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Compound Semiconductor Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Type
6.1 III-V Compound Semiconductor
6.1.1 Market Trends
6.1.2 Key Segments
6.1.2.1 Gallium Nitride
6.1.2.2 Gallium Phosphide
6.1.2.3 Gallium Arsenide
6.1.2.4 Indium Phosphide
6.1.2.5 Indium Antimonide
6.1.3 Market Forecast
6.2 II-VI Compound Semiconductor
6.2.1 Market Trends
6.2.2 Key Segments
6.2.2.1 Cadmium Selenide
6.2.2.2 Cadmium Telluride
6.2.2.3 Zinc Selenide
6.2.3 Market Forecast
6.3 Sapphire
6.3.1 Market Trends
6.3.2 Market Forecast
6.4 IV-IV Compound Semiconductor
6.4.1 Market Trends
6.4.2 Market Forecast
6.5 Others
6.5.1 Market Trends
6.5.2 Market Forecast
7 Market Breakup by Product
7.1 Power Semiconductor
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Transistor
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Integrated Circuits
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Diodes and Rectifiers
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Others
7.5.1 Market Trends
7.5.2 Market Forecast
8 Market Breakup by Deposition Technology
8.1 Chemical Vapor Deposition
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Molecular Beam Epitaxy
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Hydride Vapor Phase Epitaxy
8.3.1 Market Trends
8.3.2 Market Forecast
8.4 Ammonothermal
8.4.1 Market Trends
8.4.2 Market Forecast
8.5 Atomic Layer Deposition
8.5.1 Market Trends
8.5.2 Market Forecast
8.6 Others
8.6.1 Market Trends
8.6.2 Market Forecast
9 Market Breakup by Application
9.1 IT and Telecom
9.1.1 Market Trends
9.1.2 Market Forecast
9.2 Aerospace and Defense
9.2.1 Market Trends
9.2.2 Market Forecast
9.3 Automotive
9.3.1 Market Trends
9.3.2 Market Forecast
9.4 Consumer Electronics
9.4.1 Market Trends
9.4.2 Market Forecast
9.5 Healthcare
9.5.1 Market Trends
9.5.2 Market Forecast
9.6 Industrial and Energy and Power
9.6.1 Market Trends
9.6.2 Market Forecast
10 Market Breakup by Region
10.1 North America
10.1.1 United States
10.1.1.1 Market Trends
10.1.1.2 Market Forecast
10.1.2 Canada
10.1.2.1 Market Trends
10.1.2.2 Market Forecast
10.2 Asia-Pacific
10.2.1 China
10.2.1.1 Market Trends
10.2.1.2 Market Forecast
10.2.2 Japan
10.2.2.1 Market Trends
10.2.2.2 Market Forecast
10.2.3 India
10.2.3.1 Market Trends
10.2.3.2 Market Forecast
10.2.4 South Korea
10.2.4.1 Market Trends
10.2.4.2 Market Forecast
10.2.5 Australia
10.2.5.1 Market Trends
10.2.5.2 Market Forecast
10.2.6 Indonesia
10.2.6.1 Market Trends
10.2.6.2 Market Forecast
10.2.7 Others
10.2.7.1 Market Trends
10.2.7.2 Market Forecast
10.3 Europe
10.3.1 Germany
10.3.1.1 Market Trends
10.3.1.2 Market Forecast
10.3.2 France
10.3.2.1 Market Trends
10.3.2.2 Market Forecast
10.3.3 United Kingdom
10.3.3.1 Market Trends
10.3.3.2 Market Forecast
10.3.4 Italy
10.3.4.1 Market Trends
10.3.4.2 Market Forecast
10.3.5 Spain
10.3.5.1 Market Trends
10.3.5.2 Market Forecast
10.3.6 Russia
10.3.6.1 Market Trends
10.3.6.2 Market Forecast
10.3.7 Others
10.3.7.1 Market Trends
10.3.7.2 Market Forecast
10.4 Latin America
10.4.1 Brazil
10.4.1.1 Market Trends
10.4.1.2 Market Forecast
10.4.2 Mexico
10.4.2.1 Market Trends
10.4.2.2 Market Forecast
10.4.3 Others
10.4.3.1 Market Trends
10.4.3.2 Market Forecast
10.5 Middle East and Africa
10.5.1 Market Trends
10.5.2 Market Breakup by Country
10.5.3 Market Forecast
11 SWOT Analysis
11.1 Overview
11.2 Strengths
11.3 Weaknesses
11.4 Opportunities
11.5 Threats
12 Value Chain Analysis
13 Porters Five Forces Analysis
13.1 Overview
13.2 Bargaining Power of Buyers
13.3 Bargaining Power of Suppliers
13.4 Degree of Competition
13.5 Threat of New Entrants
13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
15.1 Market Structure
15.2 Key Players
15.3 Profiles of Key Players
15.3.1 Infineon Technologies AG
15.3.1.1 Company Overview
15.3.1.2 Product Portfolio
15.3.1.3 Financials
15.3.1.4 SWOT Analysis
15.3.2 Microchip Technology Inc.
15.3.2.1 Company Overview
15.3.2.2 Product Portfolio
15.3.2.3 Financials
15.3.2.4 SWOT Analysis
15.3.3 Mitsubishi Electric Corporation
15.3.3.1 Company Overview
15.3.3.2 Product Portfolio
15.3.3.3 Financials
15.3.3.4 SWOT Analysis
15.3.4 NXP Semiconductors N.V.
15.3.4.1 Company Overview
15.3.4.2 Product Portfolio
15.3.4.3 Financials
15.3.4.4 SWOT Analysis
15.3.5 onsemi
15.3.5.1 Company Overview
15.3.5.2 Product Portfolio
15.3.5.3 Financials
15.3.5.4 SWOT Analysis
15.3.6 Qorvo Inc.
15.3.6.1 Company Overview
15.3.6.2 Product Portfolio
15.3.6.3 Financials
15.3.6.4 SWOT Analysis
15.3.7 Renesas Electronics Corporation
15.3.7.1 Company Overview
15.3.7.2 Product Portfolio
15.3.7.3 Financials
15.3.7.4 SWOT Analysis
15.3.8 STMicroelectronics
15.3.8.1 Company Overview
15.3.8.2 Product Portfolio
15.3.8.3 Financials
15.3.8.4 SWOT Analysis
15.3.9 Texas Instruments Incorporated
15.3.9.1 Company Overview
15.3.9.2 Product Portfolio
15.3.9.3 Financials
15.3.9.4 SWOT Analysis
15.3.10 WIN Semiconductors Corp.
15.3.10.1 Company Overview
15.3.10.2 Product Portfolio
15.3.10.3 Financials
15.3.11 Wolfspeed Inc.
15.3.11.1 Company Overview
15.3.11.2 Product Portfolio
15.3.11.3 Financials
15.3.11.4 SWOT Analysis



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