1 エグゼクティブ・サマリー
2 序文
2.1 概要
2.2 ステークホルダー
2.3 調査範囲
2.4 調査方法
2.4.1 データマイニング
2.4.2 データ分析
2.4.3 データの検証
2.4.4 リサーチアプローチ
2.5 リサーチソース
2.5.1 一次調査ソース
2.5.2 セカンダリーリサーチソース
2.5.3 前提条件
3 市場動向分析
3.1 はじめに
3.2 推進要因
3.3 抑制要因
3.4 機会
3.5 脅威
3.6 技術分析
3.7 アプリケーション分析
3.8 エンドユーザー分析
3.9 新興市場
3.10 Covid-19の影響
4 ポーターズファイブフォース分析
4.1 供給者の交渉力
4.2 買い手の交渉力
4.3 代替品の脅威
4.4 新規参入の脅威
4.5 競争上のライバル関係
5 先端半導体パッケージングの世界市場、パッケージングタイプ別
5.1 はじめに
5.2 2Dパッケージング
5.3 3Dパッケージング
5.4 システムインパッケージ（SiP）
5.5 ファンアウト・ウェーハレベル・パッケージング（FOWLP）
5.6 フリップチップ包装
5.7 その他のパッケージングタイプ
6 先端半導体パッケージングの世界市場、デバイスタイプ別
6.1 はじめに
6.2 ロジックデバイス
6.3 メモリデバイス
6.4 パワーデバイス
7 先端半導体パッケージの世界市場：材料タイプ別
7.1 はじめに
7.2 シリコン
7.3 有機基板
7.4 セラミック
7.5 ガラス
7.6 その他の材料タイプ
8 先端半導体パッケージの世界市場、技術別
8.1 はじめに
8.2 ウェハーレベルパッケージ（WLP）
8.3 マルチチップパッケージ（MCP）
8.4 スルーシリコン・ビア（TSV）
9 先端半導体パッケージングの世界市場：用途別
9.1 はじめに
9.2 プロセッサ
9.3 グラフィカル・プロセッシング・ユニット（GPU）
9.4 動的ランダムアクセスメモリ（DRAM）
9.5 NANDフラッシュメモリ
9.6 イメージセンサー
9.7 その他のアプリケーション
10 先端半導体パッケージングの世界市場、エンドユーザー別
10.1 はじめに
10.2 通信
10.3 自動車
10.4 航空宇宙・防衛
10.5 医療機器
10.6 コンシューマー・エレクトロニクス
10.7 その他のエンドユーザー
11 先端半導体パッケージングの世界市場：地域別
11.1 はじめに
11.2 北米
11.2.1 アメリカ
11.2.2 カナダ
11.2.3 メキシコ
11.3 ヨーロッパ
11.3.1 ドイツ
11.3.2 イギリス
11.3.3 イタリア
11.3.4 フランス
11.3.5 スペイン
11.3.6 その他のヨーロッパ
11.4 アジア太平洋
11.4.1 日本
11.4.2 中国
11.4.3 インド
11.4.4 オーストラリア
11.4.5 ニュージーランド
11.4.6 韓国
11.4.7 その他のアジア太平洋地域
11.5 南米
11.5.1 アルゼンチン
11.5.2 ブラジル
11.5.3 チリ
11.5.4 その他の南米地域
11.6 中東・アフリカ
11.6.1 サウジアラビア
11.6.2 アラブ首長国連邦
11.6.3 カタール
11.6.4 南アフリカ
11.6.5 その他の中東・アフリカ地域
12 主要開発
12.1 契約、パートナーシップ、提携、合弁事業
12.2 買収と合併
12.3 新製品上市
12.4 拡張
12.5 その他の主要戦略
13 企業プロフィール
Samsung Electronics
Intel Corporation
Qualcomm Technologies Inc.
IBM
Microchip Technology
Renesas Electronics Corporation
Texas Instruments
Analog Devices
STMicroelectronics
Infineon Technologies AG
Avery Dennison Corporation
Sumitomo Chemical Co., Ltd.
Powertech Technology Inc.Fujitsu Semiconductor Ltd.
NVIDIA Corporation and LG Chem.
表一覧
表1 先端半導体パッケージングの世界市場展望、地域別 (2022-2030) ($MN)
表2 先端半導体パッケージングの世界市場展望、パッケージングタイプ別 (2022-2030) ($MN)
表3 先端半導体パッケージの世界市場展望、2Dパッケージ別 (2022-2030) ($MN)
表4 先端半導体パッケージングの世界市場展望、3Dパッケージング別 (2022-2030) ($MN)
表5 先端半導体パッケージングの世界市場展望、システムインパッケージ(SiP)別 (2022-2030) ($MN)
表6 先端半導体パッケージの世界市場展望、ファンアウトウェーハレベルパッケージ(FOWLP)別 (2022-2030) ($MN)
表7 先端半導体パッケージングの世界市場展望、フリップチップパッケージング別 (2022-2030) ($MN)
表8 先端半導体パッケージングの世界市場展望、その他のパッケージングタイプ別 (2022-2030) ($MN)
表9 先端半導体パッケージングの世界市場展望、デバイスタイプ別 (2022-2030) ($MN)
表10 先端半導体パッケージングの世界市場展望、ロジックデバイス別 (2022-2030) ($MN)
表11 先端半導体パッケージングの世界市場展望、メモリデバイス別 (2022-2030) ($MN)
表12 先端半導体パッケージングの世界市場展望、パワーデバイス別 (2022-2030) ($MN)
表13 先端半導体パッケージングの世界市場展望、材料タイプ別 (2022-2030) ($MN)
表14 先端半導体パッケージの世界市場展望、シリコン別 (2022-2030) ($MN)
表15 先端半導体パッケージングの世界市場展望、有機基板別 (2022-2030) ($MN)
表16 先端半導体パッケージの世界市場展望、セラミック別 (2022-2030) ($MN)
表17 先端半導体パッケージの世界市場展望、ガラス別 (2022-2030) ($MN)
表18 先端半導体パッケージの世界市場展望、その他の材料タイプ別 (2022-2030) ($MN)
表19 先端半導体パッケージングの世界市場展望、技術別 (2022-2030) ($MN)
表20 先端半導体パッケージングの世界市場展望、ウェハレベルパッケージング(WLP)別 (2022-2030) ($MN)
表21 先端半導体パッケージの世界市場展望、マルチチップパッケージ(MCP)別 (2022-2030) ($MN)
表22 先端半導体パッケージの世界市場展望、スルーシリコン・ビア(TSV)別 (2022-2030) ($MN)
表23 先端半導体パッケージングの世界市場展望、用途別 (2022-2030) ($MN)
表24 先端半導体パッケージングの世界市場展望、プロセッサ別 (2022-2030) ($MN)
表25 先端半導体パッケージングの世界市場展望、グラフィカル・プロセッシング・ユニット(GPU)別 (2022-2030) ($MN)
表26 先端半導体パッケージの世界市場展望、ダイナミックランダムアクセスメモリ(DRAM)別 (2022-2030) ($MN)
表27 先端半導体パッケージの世界市場展望、NANDフラッシュメモリ別 (2022-2030) ($MN)
表28 先端半導体パッケージの世界市場展望、イメージセンサ別 (2022-2030) ($MN)
表29 先端半導体パッケージの世界市場展望、その他の用途別 (2022-2030) ($MN)
表30 先端半導体パッケージングの世界市場展望、エンドユーザー別 (2022-2030) ($MN)
表31 先端半導体パッケージングの世界市場展望、通信別 (2022-2030) ($MN)
表32 先端半導体パッケージングの世界市場展望、自動車別 (2022-2030) ($MN)
表33 先端半導体パッケージングの世界市場展望、航空宇宙・防衛別 (2022-2030) ($MN)
表34 先端半導体パッケージングの世界市場展望、医療機器別 (2022-2030) ($MN)
表35 先端半導体パッケージングの世界市場展望、家電製品別 (2022-2030) ($MN)
表36 先端半導体パッケージングの世界市場展望、その他のエンドユーザー別 (2022-2030) ($MN)
注）北米、ヨーロッパ、APAC、南米、中東・アフリカ地域の表も上記と同様に表記しています。
Market Dynamics:
Driver:
Increased demand for electronics
As consumer electronics, IoT devices, and automotive technologies become more complex and feature-rich, the need for efficient, high-performance packaging solutions has surged. Advanced packaging techniques enable greater functionality in smaller form factors, catering to trends like miniaturization and energy efficiency. Additionally, the rise of artificial intelligence and 5G connectivity further propels this demand, as these technologies require advanced integration and robust performance, reinforcing the market's expansion.
Restraint:
Complexity of integration
Increasing complexity in semiconductor designs raises the possibility of flaws, which raises failure rates and lowers yield. Moreover, the intricate interconnections and dependencies can complicate the manufacturing process, resulting in longer production times and elevated costs. This complexity also makes it difficult to ensure reliability and thermal management, potentially hindering the overall performance of electronic devices and limiting innovation in the industry.
Opportunity:
Technological advancements
Innovations such as 3D packaging, chiplet architectures, and fan-out wafer-level packaging enhance performance while reducing size and power consumption. Techniques like through-silicon vias (TSVs) and advanced thermal management solutions improve connectivity and heat dissipation. These advancements not only enable higher integration density and faster data transfer rates but also support emerging applications in artificial intelligence, 5G, and Internet of Things (IoT) devices, driving industry growth.
Threat:
High manufacturing costs
High manufacturing costs in the market can significantly hinder industry growth and innovation. As the complexity of packaging technologies increases, so do the expenses associated with materials, equipment, and skilled labor. This financial burden can lead to reduced profit margins for manufacturers, limiting their ability to invest in research and development. Additionally, elevated costs can impede the widespread adoption of advanced packaging solutions, slowing down technological advancements across various sectors.
Covid-19 Impact:
The COVID-19 pandemic had a profound impact on the market, disrupting supply chains and causing delays in manufacturing. Lockdowns and restrictions led to a temporary shutdown of production facilities, exacerbating component shortages. Increased demand for electronics driven by remote work and digital transformation—further strained the market. While the pandemic highlighted the importance of advanced packaging for efficient and compact devices, it also exposed vulnerabilities in global supply networks, prompting companies to rethink sourcing strategies and invest in more resilient systems.
The organic substrates segment is projected to be the largest during the forecast period
The organic substrates segment is projected to account for the largest market share during the projection period. These substrates offer several advantages, including lightweight properties, compatibility with various fabrication processes. They enable intricate circuit designs and support high-density interconnections, essential for modern electronics. Additionally, organic substrates contribute to improved thermal performance and reliability, making them ideal for applications in consumer electronics, telecommunications, and automotive industries.
The image sensors segment is expected to have the highest CAGR during the forecast period
The image sensors segment is expected to have the highest CAGR during the extrapolated period. These sensors require advanced packaging solutions to enhance performance, improve integration, and minimize size while maintaining image quality. With rising demand in applications such as smartphones, automotive, and security systems, the focus on effective thermal management and protection for image sensors is essential, further propelling advancements in semiconductor packaging.
Region with largest share:
North America region is projected to account for the largest market share during the forecast period fueled by the region's strong emphasis on technological innovation and research. Additionally, government initiatives aimed at strengthening domestic manufacturing capabilities and reducing supply chain vulnerabilities are fostering a favorable environment for advancements in semiconductor packaging, positioning the region as a key player in the global landscape.
Region with highest CAGR:
Asia Pacific is expected to register the highest growth rate over the forecast period driven by robust demand from various sectors including consumer electronics, automotive. The surge in consumer electronics adoption and advancements in telecommunications technologies are fueling the demand for advanced packaging solutions. Various government policies aimed at boosting local manufacturing capabilities and attracting foreign investments are further enhancing market dynamics.
Key players in the market
Some of the key players in Advanced Semiconductor Packaging market include Samsung Electronics, Intel Corporation, Qualcomm Technologies Inc., IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, Analog Devices, STMicroelectronics, Infineon Technologies AG, Avery Dennison Corporation, Sumitomo Chemical Co., Ltd., Powertech Technology Inc.Fujitsu Semiconductor Ltd., NVIDIA Corporation and LG Chem.
Key Developments:
In August 2024, Veeco Instruments Inc. announced that IBM selected the WaferStorm® Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.
In June 2024, Rapidus Corporation and IBM announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space.
Packaging Types Covered:
• 2D Packaging
• 3D Packaging
• System-in-Package (SiP)
• Fan-Out Wafer-Level Packaging (FOWLP)
• Flip Chip Packaging
• Other Packaging Types
Device Types Covered:
• Logic Devices
• Memory Devices
• Power Devices
Material Types Covered:
• Silicon
• Organic Substrates
• Ceramic
• Glass
• Other Material Types
Technologies Covered:
• Wafer-Level Packaging (WLP)
• Multi-Chip Packages (MCP)
• Through-Silicon Via (TSV)
Applications Covered:
• Processor
• Graphical Processing Units (GPUs)
• Dynamic Random Access Memory (DRAM)
• NAND Flash Memory
• Image Sensors
• Other Applications
End Users Covered:
• Telecommunications
• Automotive
• Aerospace and Defense
• Medical Devices
• Consumer Electronics
• Other End Users
Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 Application Analysis
3.8 End User Analysis
3.9 Emerging Markets
3.10 Impact of Covid-19
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Advanced Semiconductor Packaging Market, By Packaging Type
5.1 Introduction
5.2 2D Packaging
5.3 3D Packaging
5.4 System-in-Package (SiP)
5.5 Fan-Out Wafer-Level Packaging (FOWLP)
5.6 Flip Chip Packaging
5.7 Other Packaging Types
6 Global Advanced Semiconductor Packaging Market, By Device Type
6.1 Introduction
6.2 Logic Devices
6.3 Memory Devices
6.4 Power Devices
7 Global Advanced Semiconductor Packaging Market, By Material Type
7.1 Introduction
7.2 Silicon
7.3 Organic Substrates
7.4 Ceramic
7.5 Glass
7.6 Other Material Types
8 Global Advanced Semiconductor Packaging Market, By Technology
8.1 Introduction
8.2 Wafer-Level Packaging (WLP)
8.3 Multi-Chip Packages (MCP)
8.4 Through-Silicon Via (TSV)
9 Global Advanced Semiconductor Packaging Market, By Application
9.1 Introduction
9.2 Processor
9.3 Graphical Processing Units (GPUs)
9.4 Dynamic Random Access Memory (DRAM)
9.5 NAND Flash Memory
9.6 Image Sensors
9.7 Other Applications
10 Global Advanced Semiconductor Packaging Market, By End User
10.1 Introduction
10.2 Telecommunications
10.3 Automotive
10.4 Aerospace and Defense
10.5 Medical Devices
10.6 Consumer Electronics
10.7 Other End Users
11 Global Advanced Semiconductor Packaging Market, By Geography
11.1 Introduction
11.2 North America
11.2.1 US
11.2.2 Canada
11.2.3 Mexico
11.3 Europe
11.3.1 Germany
11.3.2 UK
11.3.3 Italy
11.3.4 France
11.3.5 Spain
11.3.6 Rest of Europe
11.4 Asia Pacific
11.4.1 Japan
11.4.2 China
11.4.3 India
11.4.4 Australia
11.4.5 New Zealand
11.4.6 South Korea
11.4.7 Rest of Asia Pacific
11.5 South America
11.5.1 Argentina
11.5.2 Brazil
11.5.3 Chile
11.5.4 Rest of South America
11.6 Middle East & Africa
11.6.1 Saudi Arabia
11.6.2 UAE
11.6.3 Qatar
11.6.4 South Africa
11.6.5 Rest of Middle East & Africa
12 Key Developments
12.1 Agreements, Partnerships, Collaborations and Joint Ventures
12.2 Acquisitions & Mergers
12.3 New Product Launch
12.4 Expansions
12.5 Other Key Strategies
13 Company Profiling
13.1 Samsung Electronics
13.2 Intel Corporation
13.3 Qualcomm Technologies Inc.
13.4 IBM
13.5 Microchip Technology
13.6 Renesas Electronics Corporation
13.7 Texas Instruments
13.8 Analog Devices
13.9 STMicroelectronics
13.10 Infineon Technologies AG
13.11 Avery Dennison Corporation
13.12 Sumitomo Chemical Co., Ltd.
13.13 Powertech Technology Inc.
13.14 Fujitsu Semiconductor Ltd.
13.15 NVIDIA Corporation
13.16 LG Chem
List of Tables
Table 1 Global Advanced Semiconductor Packaging Market Outlook, By Region (2022-2030) ($MN)
Table 2 Global Advanced Semiconductor Packaging Market Outlook, By Packaging Type (2022-2030) ($MN)
Table 3 Global Advanced Semiconductor Packaging Market Outlook, By 2D Packaging (2022-2030) ($MN)
Table 4 Global Advanced Semiconductor Packaging Market Outlook, By 3D Packaging (2022-2030) ($MN)
Table 5 Global Advanced Semiconductor Packaging Market Outlook, By System-in-Package (SiP) (2022-2030) ($MN)
Table 6 Global Advanced Semiconductor Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2022-2030) ($MN)
Table 7 Global Advanced Semiconductor Packaging Market Outlook, By Flip Chip Packaging (2022-2030) ($MN)
Table 8 Global Advanced Semiconductor Packaging Market Outlook, By Other Packaging Types (2022-2030) ($MN)
Table 9 Global Advanced Semiconductor Packaging Market Outlook, By Device Type (2022-2030) ($MN)
Table 10 Global Advanced Semiconductor Packaging Market Outlook, By Logic Devices (2022-2030) ($MN)
Table 11 Global Advanced Semiconductor Packaging Market Outlook, By Memory Devices (2022-2030) ($MN)
Table 12 Global Advanced Semiconductor Packaging Market Outlook, By Power Devices (2022-2030) ($MN)
Table 13 Global Advanced Semiconductor Packaging Market Outlook, By Material Type (2022-2030) ($MN)
Table 14 Global Advanced Semiconductor Packaging Market Outlook, By Silicon (2022-2030) ($MN)
Table 15 Global Advanced Semiconductor Packaging Market Outlook, By Organic Substrates (2022-2030) ($MN)
Table 16 Global Advanced Semiconductor Packaging Market Outlook, By Ceramic (2022-2030) ($MN)
Table 17 Global Advanced Semiconductor Packaging Market Outlook, By Glass (2022-2030) ($MN)
Table 18 Global Advanced Semiconductor Packaging Market Outlook, By Other Material Types (2022-2030) ($MN)
Table 19 Global Advanced Semiconductor Packaging Market Outlook, By Technology (2022-2030) ($MN)
Table 20 Global Advanced Semiconductor Packaging Market Outlook, By Wafer-Level Packaging (WLP) (2022-2030) ($MN)
Table 21 Global Advanced Semiconductor Packaging Market Outlook, By Multi-Chip Packages (MCP) (2022-2030) ($MN)
Table 22 Global Advanced Semiconductor Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
Table 23 Global Advanced Semiconductor Packaging Market Outlook, By Application (2022-2030) ($MN)
Table 24 Global Advanced Semiconductor Packaging Market Outlook, By Processor (2022-2030) ($MN)
Table 25 Global Advanced Semiconductor Packaging Market Outlook, By Graphical Processing Units (GPUs) (2022-2030) ($MN)
Table 26 Global Advanced Semiconductor Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) (2022-2030) ($MN)
Table 27 Global Advanced Semiconductor Packaging Market Outlook, By NAND Flash Memory (2022-2030) ($MN)
Table 28 Global Advanced Semiconductor Packaging Market Outlook, By Image Sensors (2022-2030) ($MN)
Table 29 Global Advanced Semiconductor Packaging Market Outlook, By Other Applications (2022-2030) ($MN)
Table 30 Global Advanced Semiconductor Packaging Market Outlook, By End User (2022-2030) ($MN)
Table 31 Global Advanced Semiconductor Packaging Market Outlook, By Telecommunications (2022-2030) ($MN)
Table 32 Global Advanced Semiconductor Packaging Market Outlook, By Automotive (2022-2030) ($MN)
Table 33 Global Advanced Semiconductor Packaging Market Outlook, By Aerospace and Defense (2022-2030) ($MN)
Table 34 Global Advanced Semiconductor Packaging Market Outlook, By Medical Devices (2022-2030) ($MN)
Table 35 Global Advanced Semiconductor Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
Table 36 Global Advanced Semiconductor Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.
