1 Introduction to Research & Analysis Reports
1.1 Electroless Copper for Multi-Layered Boards Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Electroless Copper for Multi-Layered Boards Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Electroless Copper for Multi-Layered Boards Overall Market Size
2.1 Global Electroless Copper for Multi-Layered Boards Market Size: 2022 VS 2029
2.2 Global Electroless Copper for Multi-Layered Boards Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Electroless Copper for Multi-Layered Boards Sales: 2018-2029
3 Company Landscape
3.1 Top Electroless Copper for Multi-Layered Boards Players in Global Market
3.2 Top Global Electroless Copper for Multi-Layered Boards Companies Ranked by Revenue
3.3 Global Electroless Copper for Multi-Layered Boards Revenue by Companies
3.4 Global Electroless Copper for Multi-Layered Boards Sales by Companies
3.5 Global Electroless Copper for Multi-Layered Boards Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Electroless Copper for Multi-Layered Boards Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Electroless Copper for Multi-Layered Boards Product Type
3.8 Tier 1, Tier 2 and Tier 3 Electroless Copper for Multi-Layered Boards Players in Global Market
3.8.1 List of Global Tier 1 Electroless Copper for Multi-Layered Boards Companies
3.8.2 List of Global Tier 2 and Tier 3 Electroless Copper for Multi-Layered Boards Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Electroless Copper for Multi-Layered Boards Market Size Markets, 2022 & 2029
4.1.2 Horizontal Electroless Copper
4.1.3 Vertical Electroless Copper
4.2 By Type – Global Electroless Copper for Multi-Layered Boards Revenue & Forecasts
4.2.1 By Type – Global Electroless Copper for Multi-Layered Boards Revenue, 2018-2023
4.2.2 By Type – Global Electroless Copper for Multi-Layered Boards Revenue, 2024-2029
4.2.3 By Type – Global Electroless Copper for Multi-Layered Boards Revenue Market Share, 2018-2029
4.3 By Type – Global Electroless Copper for Multi-Layered Boards Sales & Forecasts
4.3.1 By Type – Global Electroless Copper for Multi-Layered Boards Sales, 2018-2023
4.3.2 By Type – Global Electroless Copper for Multi-Layered Boards Sales, 2024-2029
4.3.3 By Type – Global Electroless Copper for Multi-Layered Boards Sales Market Share, 2018-2029
4.4 By Type – Global Electroless Copper for Multi-Layered Boards Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Electroless Copper for Multi-Layered Boards Market Size, 2022 & 2029
5.1.2 PCB
5.1.3 IC Substrate
5.1.4 Others
5.2 By Application – Global Electroless Copper for Multi-Layered Boards Revenue & Forecasts
5.2.1 By Application – Global Electroless Copper for Multi-Layered Boards Revenue, 2018-2023
5.2.2 By Application – Global Electroless Copper for Multi-Layered Boards Revenue, 2024-2029
5.2.3 By Application – Global Electroless Copper for Multi-Layered Boards Revenue Market Share, 2018-2029
5.3 By Application – Global Electroless Copper for Multi-Layered Boards Sales & Forecasts
5.3.1 By Application – Global Electroless Copper for Multi-Layered Boards Sales, 2018-2023
5.3.2 By Application – Global Electroless Copper for Multi-Layered Boards Sales, 2024-2029
5.3.3 By Application – Global Electroless Copper for Multi-Layered Boards Sales Market Share, 2018-2029
5.4 By Application – Global Electroless Copper for Multi-Layered Boards Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global Electroless Copper for Multi-Layered Boards Market Size, 2022 & 2029
6.2 By Region – Global Electroless Copper for Multi-Layered Boards Revenue & Forecasts
6.2.1 By Region – Global Electroless Copper for Multi-Layered Boards Revenue, 2018-2023
6.2.2 By Region – Global Electroless Copper for Multi-Layered Boards Revenue, 2024-2029
6.2.3 By Region – Global Electroless Copper for Multi-Layered Boards Revenue Market Share, 2018-2029
6.3 By Region – Global Electroless Copper for Multi-Layered Boards Sales & Forecasts
6.3.1 By Region – Global Electroless Copper for Multi-Layered Boards Sales, 2018-2023
6.3.2 By Region – Global Electroless Copper for Multi-Layered Boards Sales, 2024-2029
6.3.3 By Region – Global Electroless Copper for Multi-Layered Boards Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America Electroless Copper for Multi-Layered Boards Revenue, 2018-2029
6.4.2 By Country – North America Electroless Copper for Multi-Layered Boards Sales, 2018-2029
6.4.3 US Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.4.4 Canada Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.4.5 Mexico Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe Electroless Copper for Multi-Layered Boards Revenue, 2018-2029
6.5.2 By Country – Europe Electroless Copper for Multi-Layered Boards Sales, 2018-2029
6.5.3 Germany Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.5.4 France Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.5.5 U.K. Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.5.6 Italy Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.5.7 Russia Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.5.8 Nordic Countries Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.5.9 Benelux Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia Electroless Copper for Multi-Layered Boards Revenue, 2018-2029
6.6.2 By Region – Asia Electroless Copper for Multi-Layered Boards Sales, 2018-2029
6.6.3 China Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.6.4 Japan Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.6.5 South Korea Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.6.6 Southeast Asia Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.6.7 India Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America Electroless Copper for Multi-Layered Boards Revenue, 2018-2029
6.7.2 By Country – South America Electroless Copper for Multi-Layered Boards Sales, 2018-2029
6.7.3 Brazil Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.7.4 Argentina Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Electroless Copper for Multi-Layered Boards Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa Electroless Copper for Multi-Layered Boards Sales, 2018-2029
6.8.3 Turkey Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.8.4 Israel Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.8.5 Saudi Arabia Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
6.8.6 UAE Electroless Copper for Multi-Layered Boards Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 DuPont
7.1.1 DuPont Company Summary
7.1.2 DuPont Business Overview
7.1.3 DuPont Electroless Copper for Multi-Layered Boards Major Product Offerings
7.1.4 DuPont Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.1.5 DuPont Key News & Latest Developments
7.2 MacDermid Alpha Electronics Solutions
7.2.1 MacDermid Alpha Electronics Solutions Company Summary
7.2.2 MacDermid Alpha Electronics Solutions Business Overview
7.2.3 MacDermid Alpha Electronics Solutions Electroless Copper for Multi-Layered Boards Major Product Offerings
7.2.4 MacDermid Alpha Electronics Solutions Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.2.5 MacDermid Alpha Electronics Solutions Key News & Latest Developments
7.3 Atotech
7.3.1 Atotech Company Summary
7.3.2 Atotech Business Overview
7.3.3 Atotech Electroless Copper for Multi-Layered Boards Major Product Offerings
7.3.4 Atotech Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.3.5 Atotech Key News & Latest Developments
7.4 Uyemura
7.4.1 Uyemura Company Summary
7.4.2 Uyemura Business Overview
7.4.3 Uyemura Electroless Copper for Multi-Layered Boards Major Product Offerings
7.4.4 Uyemura Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.4.5 Uyemura Key News & Latest Developments
7.5 ICAPE GROUP
7.5.1 ICAPE GROUP Company Summary
7.5.2 ICAPE GROUP Business Overview
7.5.3 ICAPE GROUP Electroless Copper for Multi-Layered Boards Major Product Offerings
7.5.4 ICAPE GROUP Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.5.5 ICAPE GROUP Key News & Latest Developments
7.6 Eurocircuits
7.6.1 Eurocircuits Company Summary
7.6.2 Eurocircuits Business Overview
7.6.3 Eurocircuits Electroless Copper for Multi-Layered Boards Major Product Offerings
7.6.4 Eurocircuits Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.6.5 Eurocircuits Key News & Latest Developments
7.7 Sharretts Plating
7.7.1 Sharretts Plating Company Summary
7.7.2 Sharretts Plating Business Overview
7.7.3 Sharretts Plating Electroless Copper for Multi-Layered Boards Major Product Offerings
7.7.4 Sharretts Plating Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.7.5 Sharretts Plating Key News & Latest Developments
7.8 SCHMID Group
7.8.1 SCHMID Group Company Summary
7.8.2 SCHMID Group Business Overview
7.8.3 SCHMID Group Electroless Copper for Multi-Layered Boards Major Product Offerings
7.8.4 SCHMID Group Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.8.5 SCHMID Group Key News & Latest Developments
7.9 Taiyo Manufacturing
7.9.1 Taiyo Manufacturing Company Summary
7.9.2 Taiyo Manufacturing Business Overview
7.9.3 Taiyo Manufacturing Electroless Copper for Multi-Layered Boards Major Product Offerings
7.9.4 Taiyo Manufacturing Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.9.5 Taiyo Manufacturing Key News & Latest Developments
7.10 Transene
7.10.1 Transene Company Summary
7.10.2 Transene Business Overview
7.10.3 Transene Electroless Copper for Multi-Layered Boards Major Product Offerings
7.10.4 Transene Electroless Copper for Multi-Layered Boards Sales and Revenue in Global (2018-2023)
7.10.5 Transene Key News & Latest Developments
8 Global Electroless Copper for Multi-Layered Boards Production Capacity, Analysis
8.1 Global Electroless Copper for Multi-Layered Boards Production Capacity, 2018-2029
8.2 Electroless Copper for Multi-Layered Boards Production Capacity of Key Manufacturers in Global Market
8.3 Global Electroless Copper for Multi-Layered Boards Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Electroless Copper for Multi-Layered Boards Supply Chain Analysis
10.1 Electroless Copper for Multi-Layered Boards Industry Value Chain
10.2 Electroless Copper for Multi-Layered Boards Upstream Market
10.3 Electroless Copper for Multi-Layered Boards Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Electroless Copper for Multi-Layered Boards Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer
世界の多層基板用無電解銅市場予測2023-2029：横型無電解銅、縦型無電解銅 |
| 【英語タイトル】Electroless Copper for Multi-Layered Boards Market, Global Outlook and Forecast 2023-2029 | |
 | ・商品コード：MMG23JU2228 ・発行会社（調査会社）：Market Monitor Global ・発行日：2023年6月 ・ページ数：77 ・レポート言語：英語 ・レポート形式：PDF ・納品方法：Eメール（受注後2-3営業日） ・調査対象地域：グローバル、北米、アメリカ、ヨーロッパ、アジア、日本、中国、東南アジア、インド、南米、中東・アフリカなど ・産業分野：電子＆半導体 |
| Single User（1名様閲覧用） | USD3,250 ⇒換算￥494,000 | 見積依頼/購入/質問フォーム |
| Multi User（20名様閲覧用） | USD4,225 ⇒換算￥642,200 | 見積依頼/購入/質問フォーム |
| Enterprise User（閲覧人数制限なし） | USD4,875 ⇒換算￥741,000 | 見積依頼/購入/質問フォーム |
|
※販売価格オプションの説明 ※お支払金額：換算金額（日本円）＋消費税 ※納期：即日〜2営業日（3日以上かかる場合は別途表記又はご連絡） ※お支払方法：納品日＋5日以内に請求書を発行・送付（請求書発行日より2ヶ月以内に銀行振込、振込先：三菱UFJ銀行/H&Iグローバルリサーチ株式会社、支払期限と方法は調整可能） |
| 当調査レポートは次の情報を含め、世界の多層基板用無電解銅市場規模と予測を収録しています。・世界の多層基板用無電解銅市場：売上、2018年-2023年、2024年-2029年 ・世界の多層基板用無電解銅市場：販売量、2018年-2023年、2024年-2029年 ・世界のトップ5企業、2022年 世界の多層基板用無電解銅市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「横型無電解銅」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。 多層基板用無電解銅のグローバル主要企業は、DuPont、 MacDermid Alpha Electronics Solutions、 Atotech、 Uyemura、 ICAPE GROUP、 Eurocircuits、 Sharretts Plating、 SCHMID Group、 Taiyo Manufacturing、 Transeneなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。 MARKET MONITOR GLOBAL（MMG）は、多層基板用無電解銅のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。 【セグメント別市場分析】 世界の多層基板用無電解銅市場：タイプ別、2018年-2023年、2024年-2029年 世界の多層基板用無電解銅市場：タイプ別市場シェア、2022年 ・横型無電解銅、縦型無電解銅 世界の多層基板用無電解銅市場：用途別、2018年-2023年、2024年-2029年 世界の多層基板用無電解銅市場：用途別市場シェア、2022年 ・PCB、IC基板、その他 世界の多層基板用無電解銅市場：地域・国別、2018年-2023年、2024年-2029年 世界の多層基板用無電解銅市場：地域別市場シェア、2022年 ・北米：アメリカ、カナダ、メキシコ ・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア ・アジア：中国、日本、韓国、東南アジア、インド ・南米：ブラジル、アルゼンチン ・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE 【競合分析】 また、当レポートは主要な市場参加者の分析を提供します。 ・主要企業における多層基板用無電解銅のグローバル売上、2018年-2023年 ・主要企業における多層基板用無電解銅のグローバル売上シェア、2022年 ・主要企業における多層基板用無電解銅のグローバル販売量、2018年-2023年 ・主要企業における多層基板用無電解銅のグローバル販売量シェア、2022年 さらに、当レポートは主要企業のプロファイルを提示します。 DuPont、 MacDermid Alpha Electronics Solutions、 Atotech、 Uyemura、 ICAPE GROUP、 Eurocircuits、 Sharretts Plating、 SCHMID Group、 Taiyo Manufacturing、 Transene ************************************************************* ・調査・分析レポートの概要 多層基板用無電解銅市場の定義 市場セグメント 世界の多層基板用無電解銅市場概要 当レポートの特徴・ベネフィット 調査手法と情報源 ・世界の多層基板用無電解銅市場規模 世界の多層基板用無電解銅市場規模：2022年 VS 2029年 世界の多層基板用無電解銅市場規模と予測 2018年-2029年 ・競争状況 グローバルトップ企業 売上ベースでのグローバルトップ企業 企業別グローバルでの多層基板用無電解銅の売上 グローバルトップ3およびトップ5企業、2022年売上ベース グローバル企業の多層基板用無電解銅製品タイプ グローバルにおけるティア1、ティア2、ティア3企業 ・タイプ別市場分析 タイプ区分：横型無電解銅、縦型無電解銅 多層基板用無電解銅のタイプ別グローバル売上・予測 ・用途別市場分析 用途区分：PCB、IC基板、その他 多層基板用無電解銅の用途別グローバル売上・予測 ・地域別市場分析 地域別多層基板用無電解銅市場規模 2022年と2029年 地域別多層基板用無電解銅売上・予測 北米市場：アメリカ、カナダ、メキシコ ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア アジア市場：中国、日本、韓国、東南アジア、インド 南米市場：ブラジル、アルゼンチン 中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE ・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど） DuPont、 MacDermid Alpha Electronics Solutions、 Atotech、 Uyemura、 ICAPE GROUP、 Eurocircuits、 Sharretts Plating、 SCHMID Group、 Taiyo Manufacturing、 Transene ... |
Electroless Copper for Multi-Layered Boards is an autocatalytic redox reaction. First, it is treated with an activator to adsorb a layer of active particles on the surface of the insulating substrate. Usually, metal palladium particles are used. Copper ions are first reduced on these active metal palladium particles, and the reduced metal copper nuclei themselves. It becomes the catalytic layer of copper ions, so that the reduction reaction of copper continues on the surface of these new copper nuclei.
This report aims to provide a comprehensive presentation of the global market for Electroless Copper for Multi-Layered Boards, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electroless Copper for Multi-Layered Boards. This report contains market size and forecasts of Electroless Copper for Multi-Layered Boards in global, including the following market information:
Global Electroless Copper for Multi-Layered Boards Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Electroless Copper for Multi-Layered Boards Market Sales, 2018-2023, 2024-2029, (K Sqm)
Global top five Electroless Copper for Multi-Layered Boards companies in 2022 (%)
The global Electroless Copper for Multi-Layered Boards market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Horizontal Electroless Copper Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Electroless Copper for Multi-Layered Boards include DuPont, MacDermid Alpha Electronics Solutions, Atotech, Uyemura, ICAPE GROUP, Eurocircuits, Sharretts Plating, SCHMID Group and Taiyo Manufacturing, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Electroless Copper for Multi-Layered Boards manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Electroless Copper for Multi-Layered Boards Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Electroless Copper for Multi-Layered Boards Market Segment Percentages, by Type, 2022 (%)
Horizontal Electroless Copper
Vertical Electroless Copper
Global Electroless Copper for Multi-Layered Boards Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Electroless Copper for Multi-Layered Boards Market Segment Percentages, by Application, 2022 (%)
PCB
IC Substrate
Others
Global Electroless Copper for Multi-Layered Boards Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Sqm)
Global Electroless Copper for Multi-Layered Boards Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Electroless Copper for Multi-Layered Boards revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Electroless Copper for Multi-Layered Boards revenues share in global market, 2022 (%)
Key companies Electroless Copper for Multi-Layered Boards sales in global market, 2018-2023 (Estimated), (K Sqm)
Key companies Electroless Copper for Multi-Layered Boards sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
DuPont
MacDermid Alpha Electronics Solutions
Atotech
Uyemura
ICAPE GROUP
Eurocircuits
Sharretts Plating
SCHMID Group
Taiyo Manufacturing
Transene
Outline of Major Chapters:
Chapter 1: Introduces the definition of Electroless Copper for Multi-Layered Boards, market overview.
Chapter 2: Global Electroless Copper for Multi-Layered Boards market size in revenue and volume.
Chapter 3: Detailed analysis of Electroless Copper for Multi-Layered Boards manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Electroless Copper for Multi-Layered Boards in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Electroless Copper for Multi-Layered Boards capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
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