1 Market Overview
1.1 Copper Electroplating for IC Substrates Introduction
1.2 Market Analysis by Type
1.2.1 Overview: Global Copper Electroplating for IC Substrates Revenue by Type: 2017 Versus 2021 Versus 2028
1.2.2 Acid Plating
1.2.3 Alkaline Plating
1.3 Market Analysis by Application
1.3.1 Overview: Global Copper Electroplating for IC Substrates Revenue by Application: 2017 Versus 2021 Versus 2028
1.3.2 Semiconductor Packaging
1.3.3 PCB
1.3.4 Others
1.4 Global Copper Electroplating for IC Substrates Market Size & Forecast
1.4.1 Global Copper Electroplating for IC Substrates Sales in Value (2017 & 2021 & 2028)
1.4.2 Global Copper Electroplating for IC Substrates Sales in Volume (2017-2028)
1.4.3 Global Copper Electroplating for IC Substrates Price (2017-2028)
1.5 Global Copper Electroplating for IC Substrates Production Capacity Analysis
1.5.1 Global Copper Electroplating for IC Substrates Total Production Capacity (2017-2028)
1.5.2 Global Copper Electroplating for IC Substrates Production Capacity by Geographic Region
1.6 Market Drivers, Restraints and Trends
1.6.1 Copper Electroplating for IC Substrates Market Drivers
1.6.2 Copper Electroplating for IC Substrates Market Restraints
1.6.3 Copper Electroplating for IC Substrates Trends Analysis
2 Manufacturers Profiles
2.1 Heraeus
2.1.1 Heraeus Details
2.1.2 Heraeus Major Business
2.1.3 Heraeus Copper Electroplating for IC Substrates Product and Services
2.1.4 Heraeus Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.2 Tanaka
2.2.1 Tanaka Details
2.2.2 Tanaka Major Business
2.2.3 Tanaka Copper Electroplating for IC Substrates Product and Services
2.2.4 Tanaka Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.3 Sumitomo Metal Mining
2.3.1 Sumitomo Metal Mining Details
2.3.2 Sumitomo Metal Mining Major Business
2.3.3 Sumitomo Metal Mining Copper Electroplating for IC Substrates Product and Services
2.3.4 Sumitomo Metal Mining Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.4 MK Electron
2.4.1 MK Electron Details
2.4.2 MK Electron Major Business
2.4.3 MK Electron Copper Electroplating for IC Substrates Product and Services
2.4.4 MK Electron Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.5 AMETEK
2.5.1 AMETEK Details
2.5.2 AMETEK Major Business
2.5.3 AMETEK Copper Electroplating for IC Substrates Product and Services
2.5.4 AMETEK Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.6 MacDermid Enthone
2.6.1 MacDermid Enthone Details
2.6.2 MacDermid Enthone Major Business
2.6.3 MacDermid Enthone Copper Electroplating for IC Substrates Product and Services
2.6.4 MacDermid Enthone Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.7 Doublink Solders
2.7.1 Doublink Solders Details
2.7.2 Doublink Solders Major Business
2.7.3 Doublink Solders Copper Electroplating for IC Substrates Product and Services
2.7.4 Doublink Solders Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.8 Yantai Zhaojin Kanfort
2.8.1 Yantai Zhaojin Kanfort Details
2.8.2 Yantai Zhaojin Kanfort Major Business
2.8.3 Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Product and Services
2.8.4 Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.9 Tatsuta Electric Wire & Cable
2.9.1 Tatsuta Electric Wire & Cable Details
2.9.2 Tatsuta Electric Wire & Cable Major Business
2.9.3 Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Product and Services
2.9.4 Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.10 Kangqiang Electronics
2.10.1 Kangqiang Electronics Details
2.10.2 Kangqiang Electronics Major Business
2.10.3 Kangqiang Electronics Copper Electroplating for IC Substrates Product and Services
2.10.4 Kangqiang Electronics Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.11 The Prince & Izant
2.11.1 The Prince & Izant Details
2.11.2 The Prince & Izant Major Business
2.11.3 The Prince & Izant Copper Electroplating for IC Substrates Product and Services
2.11.4 The Prince & Izant Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.12 Guangzhou Sanfu New Material Technology
2.12.1 Guangzhou Sanfu New Material Technology Details
2.12.2 Guangzhou Sanfu New Material Technology Major Business
2.12.3 Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Product and Services
2.12.4 Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.13 Shanghai Yongsheng Auxiliary Factory
2.13.1 Shanghai Yongsheng Auxiliary Factory Details
2.13.2 Shanghai Yongsheng Auxiliary Factory Major Business
2.13.3 Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Product and Services
2.13.4 Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.14 Atotech
2.14.1 Atotech Details
2.14.2 Atotech Major Business
2.14.3 Atotech Copper Electroplating for IC Substrates Product and Services
2.14.4 Atotech Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
2.15 Jiangsu Mengde New Material Technology
2.15.1 Jiangsu Mengde New Material Technology Details
2.15.2 Jiangsu Mengde New Material Technology Major Business
2.15.3 Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Product and Services
2.15.4 Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 Copper Electroplating for IC Substrates Breakdown Data by Manufacturer
3.1 Global Copper Electroplating for IC Substrates Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
3.2 Global Copper Electroplating for IC Substrates Revenue by Manufacturer (2019, 2020, 2021, and 2022)
3.3 Key Manufacturer Market Position in Copper Electroplating for IC Substrates
3.4 Market Concentration Rate
3.4.1 Top 3 Copper Electroplating for IC Substrates Manufacturer Market Share in 2021
3.4.2 Top 6 Copper Electroplating for IC Substrates Manufacturer Market Share in 2021
3.5 Global Copper Electroplating for IC Substrates Production Capacity by Company: 2021 VS 2022
3.6 Manufacturer by Geography: Head Office and Copper Electroplating for IC Substrates Production Site
3.7 New Entrant and Capacity Expansion Plans
3.8 Mergers & Acquisitions
4 Market Analysis by Region
4.1 Global Copper Electroplating for IC Substrates Market Size by Region
4.1.1 Global Copper Electroplating for IC Substrates Sales in Volume by Region (2017-2028)
4.1.2 Global Copper Electroplating for IC Substrates Revenue by Region (2017-2028)
4.2 North America Copper Electroplating for IC Substrates Revenue (2017-2028)
4.3 Europe Copper Electroplating for IC Substrates Revenue (2017-2028)
4.4 Asia-Pacific Copper Electroplating for IC Substrates Revenue (2017-2028)
4.5 South America Copper Electroplating for IC Substrates Revenue (2017-2028)
4.6 Middle East and Africa Copper Electroplating for IC Substrates Revenue (2017-2028)
5 Market Segment by Type
5.1 Global Copper Electroplating for IC Substrates Sales in Volume by Type (2017-2028)
5.2 Global Copper Electroplating for IC Substrates Revenue by Type (2017-2028)
5.3 Global Copper Electroplating for IC Substrates Price by Type (2017-2028)
6 Market Segment by Application
6.1 Global Copper Electroplating for IC Substrates Sales in Volume by Application (2017-2028)
6.2 Global Copper Electroplating for IC Substrates Revenue by Application (2017-2028)
6.3 Global Copper Electroplating for IC Substrates Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
7.1 North America Copper Electroplating for IC Substrates Sales by Type (2017-2028)
7.2 North America Copper Electroplating for IC Substrates Sales by Application (2017-2028)
7.3 North America Copper Electroplating for IC Substrates Market Size by Country
7.3.1 North America Copper Electroplating for IC Substrates Sales in Volume by Country (2017-2028)
7.3.2 North America Copper Electroplating for IC Substrates Revenue by Country (2017-2028)
7.3.3 United States Market Size and Forecast (2017-2028)
7.3.4 Canada Market Size and Forecast (2017-2028)
7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
8.1 Europe Copper Electroplating for IC Substrates Sales by Type (2017-2028)
8.2 Europe Copper Electroplating for IC Substrates Sales by Application (2017-2028)
8.3 Europe Copper Electroplating for IC Substrates Market Size by Country
8.3.1 Europe Copper Electroplating for IC Substrates Sales in Volume by Country (2017-2028)
8.3.2 Europe Copper Electroplating for IC Substrates Revenue by Country (2017-2028)
8.3.3 Germany Market Size and Forecast (2017-2028)
8.3.4 France Market Size and Forecast (2017-2028)
8.3.5 United Kingdom Market Size and Forecast (2017-2028)
8.3.6 Russia Market Size and Forecast (2017-2028)
8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
9.1 Asia-Pacific Copper Electroplating for IC Substrates Sales by Type (2017-2028)
9.2 Asia-Pacific Copper Electroplating for IC Substrates Sales by Application (2017-2028)
9.3 Asia-Pacific Copper Electroplating for IC Substrates Market Size by Region
9.3.1 Asia-Pacific Copper Electroplating for IC Substrates Sales in Volume by Region (2017-2028)
9.3.2 Asia-Pacific Copper Electroplating for IC Substrates Revenue by Region (2017-2028)
9.3.3 China Market Size and Forecast (2017-2028)
9.3.4 Japan Market Size and Forecast (2017-2028)
9.3.5 Korea Market Size and Forecast (2017-2028)
9.3.6 India Market Size and Forecast (2017-2028)
9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
10.1 South America Copper Electroplating for IC Substrates Sales by Type (2017-2028)
10.2 South America Copper Electroplating for IC Substrates Sales by Application (2017-2028)
10.3 South America Copper Electroplating for IC Substrates Market Size by Country
10.3.1 South America Copper Electroplating for IC Substrates Sales in Volume by Country (2017-2028)
10.3.2 South America Copper Electroplating for IC Substrates Revenue by Country (2017-2028)
10.3.3 Brazil Market Size and Forecast (2017-2028)
10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
11.1 Middle East & Africa Copper Electroplating for IC Substrates Sales by Type (2017-2028)
11.2 Middle East & Africa Copper Electroplating for IC Substrates Sales by Application (2017-2028)
11.3 Middle East & Africa Copper Electroplating for IC Substrates Market Size by Country
11.3.1 Middle East & Africa Copper Electroplating for IC Substrates Sales in Volume by Country (2017-2028)
11.3.2 Middle East & Africa Copper Electroplating for IC Substrates Revenue by Country (2017-2028)
11.3.3 Turkey Market Size and Forecast (2017-2028)
11.3.4 Egypt Market Size and Forecast (2017-2028)
11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
12.1 Raw Material of Copper Electroplating for IC Substrates and Key Manufacturers
12.2 Manufacturing Costs Percentage of Copper Electroplating for IC Substrates
12.3 Copper Electroplating for IC Substrates Production Process
12.4 Copper Electroplating for IC Substrates Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
13.1 Sales Channel
13.1.1 Direct Marketing
13.1.2 Indirect Marketing
13.2 Copper Electroplating for IC Substrates Typical Distributors
13.3 Copper Electroplating for IC Substrates Typical Customers
14 Research Findings and Conclusion
15 Appendix
15.1 Methodology
15.2 Research Process and Data Source
15.3 Disclaimer
世界のIC基板用電気銅めっき市場2022年：酸性メッキ、アルカリメッキ |
| 【英語タイトル】Global Copper Electroplating for IC Substrates Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028 | |
 | ・商品コード：GIR22NO7098 ・発行会社（調査会社）：GlobalInfoResearch ・発行日：2022年11月2日（※2025年版があります。お問い合わせください。） ・ページ数：112 ・レポート言語：英語 ・レポート形式：PDF ・納品方法：Eメール（注文後2-3日） ・調査対象地域：グローバル ・産業分野：電子＆半導体 |
| Single User（1名様閲覧用） | USD3,480 ⇒換算￥522,000 | 見積依頼/購入/質問フォーム |
| Multi User（20名様閲覧用） | USD5,220 ⇒換算￥783,000 | 見積依頼/購入/質問フォーム |
| Corporate User（同一法人内共有可） | USD6,960 ⇒換算￥1,044,000 | 見積依頼/購入/質問フォーム |
|
※販売価格オプションの説明 ※お支払金額：換算金額（日本円）＋消費税 ※納期：即日〜2営業日（3日以上かかる場合は別途表記又はご連絡） ※お支払方法：納品日＋5日以内に請求書を発行・送付（請求書発行日より2ヶ月以内に銀行振込、振込先：三菱UFJ銀行/H&Iグローバルリサーチ株式会社、支払期限と方法は調整可能） |
| IC基板用電気銅めっき市場レポートは、世界の市場規模、地域および国レベルの市場規模、セグメント市場の成長性、市場シェア、競争環境、販売分析、国内および世界の市場プレーヤーの影響、バリューチェーンの最適化、最近の動向、機会分析、市場成長の戦略的な分析、製品発売、地域市場の拡大などに関する情報を提供します。 GlobalInfoResearchの最新の調査によると、世界のIC基板用電気銅めっきの市場規模は2021年のxxx米ドルから2028年にはxxx米ドルと推定され、xxx％の成長率で成長すると予想されます。 IC基板用電気銅めっき市場は種類と用途によって区分されます。2017年～2028年において、量と金額の観点から種類別および用途別セグメントの売上予測データを提供します。この分析は、適格なニッチ市場をターゲットにすることでビジネスを拡大するのに役立ちます。 種類別セグメントは次をカバーします。 ・酸性メッキ、アルカリメッキ 用途別セグメントは次のように区分されます。 ・半導体パッケージ、PCB、その他 世界のIC基板用電気銅めっき市場の主要な市場プレーヤーは以下のとおりです。 ・Heraeus、Tanaka、Sumitomo Metal Mining、MK Electron、AMETEK、MacDermid Enthone、Doublink Solders、Yantai Zhaojin Kanfort、Tatsuta Electric Wire & Cable、Kangqiang Electronics、The Prince & Izant、Guangzhou Sanfu New Material Technology、Shanghai Yongsheng Auxiliary Factory、Atotech、Jiangsu Mengde New Material Technology 地域別セグメントは次の地域・国をカバーします。 ・北米（米国、カナダ、メキシコ） ・ヨーロッパ（ドイツ、フランス、イギリス、ロシア、イタリア） ・アジア太平洋（日本、中国、韓国、インド、東南アジア、オーストラリア） ・南アメリカ（ブラジル、アルゼンチン、コロンビア） ・中東およびアフリカ（サウジアラビア、UAE、エジプト、南アフリカ） 本調査レポートの内容は計15章あります。 ・第1章では、IC基板用電気銅めっき製品の調査範囲、市場の概要、市場の成長要因・阻害要因、および市場動向について説明します。 ・第2章では、主要なIC基板用電気銅めっきメーカーの企業概要、2019年～2022年までのIC基板用電気銅めっきの価格、販売量、売上、市場シェアを掲載しています。 ・第3章では、主要なIC基板用電気銅めっきメーカーの競争状況、販売量、売上、世界市場シェアが重点的に比較分析されています。 ・第4章では、2017年～2028年までの地域別IC基板用電気銅めっきの販売量、売上、成長性を示しています。 ・第5、6章では、2017年～2028年までのIC基板用電気銅めっきの種類別と用途別の市場規模、市場シェアと成長率を掲載しています。 ・第7、8、9、10、11章では、2017年～2022年までの世界の主要国での販売量、売上、市場シェア、並びに2023年～2028年までの主要地域でのIC基板用電気銅めっき市場予測を収録しています。 ・第12章では、主要な原材料、主要なサプライヤー、およびIC基板用電気銅めっきの産業チェーンを掲載しています。 ・第13、14、15章では、IC基板用電気銅めっきの販売チャネル、販売業者、顧客、調査結果と結論、付録、データソースなどについて説明します。 ***** 目次(一部) ***** ・市場概要 - IC基板用電気銅めっきの概要 - 種類別分析（2017年vs2021年vs2028年）：酸性メッキ、アルカリメッキ - 用途別分析（2017年vs2021年vs2028年）：半導体パッケージ、PCB、その他 - 世界のIC基板用電気銅めっき市場規模・予測 - 世界のIC基板用電気銅めっき生産能力分析 - 市場の成長要因・阻害要因・動向 ・メーカー情報（企業概要、製品概要、販売量、価格、売上） - Heraeus、Tanaka、Sumitomo Metal Mining、MK Electron、AMETEK、MacDermid Enthone、Doublink Solders、Yantai Zhaojin Kanfort、Tatsuta Electric Wire & Cable、Kangqiang Electronics、The Prince & Izant、Guangzhou Sanfu New Material Technology、Shanghai Yongsheng Auxiliary Factory、Atotech、Jiangsu Mengde New Material Technology ・メーカー別市場シェア・市場集中度 ・地域別市場分析2017年-2028年 ・種類別分析2017年-2028年：酸性メッキ、アルカリメッキ ・用途別分析2017年-2028年：半導体パッケージ、PCB、その他 ・IC基板用電気銅めっきの北米市場 - 種類別市場規模2017年-2028年 - 用途別市場規模2017年-2028年 - 主要国別市場規模：アメリカ、カナダ、メキシコなど ・IC基板用電気銅めっきのヨーロッパ市場 - 種類別市場規模2017年-2028年 - 用途別市場規模2017年-2028年 - 主要国別市場規模：ドイツ、イギリス、フランス、ロシア、イタリアなど ・IC基板用電気銅めっきのアジア市場 - 種類別市場規模2017年-2028年 - 用途別市場規模2017年-2028年 - 主要国別市場規模：中国、日本、韓国、インド、東南アジア、オーストラリアなど ・IC基板用電気銅めっきの南米市場 - 種類別市場規模2017年-2028年 - 用途別市場規模2017年-2028年 - 主要国別市場規模：ブラジル、アルゼンチンなど ・IC基板用電気銅めっきの中東・アフリカ市場 - 種類別市場規模2017年-2028年 - 用途別市場規模2017年-2028年 - 主要国別市場規模：サウジアラビア、トルコ、エジプト、南アフリカなど ・原材料および産業チェーン ・販売チャネル、流通業者・代理店、顧客リスト ・調査の結果・結論 |
The Copper Electroplating for IC Substrates market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Copper Electroplating for IC Substrates market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during forecast period 2022-2028. Semiconductor Packaging accounting for % of the Copper Electroplating for IC Substrates global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Acid Plating segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Copper Electroplating for IC Substrates include Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, and AMETEK, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Copper Electroplating for IC Substrates market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
Acid Plating
Alkaline Plating
Market segment by Application can be divided into
Semiconductor Packaging
PCB
Others
The key market players for global Copper Electroplating for IC Substrates market are listed below:
Heraeus
Tanaka
Sumitomo Metal Mining
MK Electron
AMETEK
MacDermid Enthone
Doublink Solders
Yantai Zhaojin Kanfort
Tatsuta Electric Wire & Cable
Kangqiang Electronics
The Prince & Izant
Guangzhou Sanfu New Material Technology
Shanghai Yongsheng Auxiliary Factory
Atotech
Jiangsu Mengde New Material Technology
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Copper Electroplating for IC Substrates product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Copper Electroplating for IC Substrates, with price, sales, revenue and global market share of Copper Electroplating for IC Substrates from 2019 to 2022.
Chapter 3, the Copper Electroplating for IC Substrates competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Copper Electroplating for IC Substrates breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Copper Electroplating for IC Substrates market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Copper Electroplating for IC Substrates.
Chapter 13, 14, and 15, to describe Copper Electroplating for IC Substrates sales channel, distributors, customers, research findings and conclusion, appendix and data source.
| ★調査レポート[世界のIC基板用電気銅めっき市場2022年：酸性メッキ、アルカリメッキ] (コード：GIR22NO7098)販売に関する免責事項を必ずご確認ください。 |
| ★調査レポート[世界のIC基板用電気銅めっき市場2022年：酸性メッキ、アルカリメッキ]についてメールでお問い合わせ |
