1 Introduction to Research & Analysis Reports
1.1 Molded Interconnect Devices Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Molded Interconnect Devices Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Molded Interconnect Devices Overall Market Size
2.1 Global Molded Interconnect Devices Market Size: 2022 VS 2029
2.2 Global Molded Interconnect Devices Revenue, Prospects & Forecasts: 2018-2029
2.3 Global Molded Interconnect Devices Sales: 2018-2029
3 Company Landscape
3.1 Top Molded Interconnect Devices Players in Global Market
3.2 Top Global Molded Interconnect Devices Companies Ranked by Revenue
3.3 Global Molded Interconnect Devices Revenue by Companies
3.4 Global Molded Interconnect Devices Sales by Companies
3.5 Global Molded Interconnect Devices Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 Molded Interconnect Devices Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers Molded Interconnect Devices Product Type
3.8 Tier 1, Tier 2 and Tier 3 Molded Interconnect Devices Players in Global Market
3.8.1 List of Global Tier 1 Molded Interconnect Devices Companies
3.8.2 List of Global Tier 2 and Tier 3 Molded Interconnect Devices Companies
4 Sights by Product
4.1 Overview
4.1.1 By Type – Global Molded Interconnect Devices Market Size Markets, 2022 & 2029
4.1.2 Laser Direct Structuring (LDS)
4.1.3 Two-Shot Molding
4.1.4 Others
4.2 By Type – Global Molded Interconnect Devices Revenue & Forecasts
4.2.1 By Type – Global Molded Interconnect Devices Revenue, 2018-2023
4.2.2 By Type – Global Molded Interconnect Devices Revenue, 2024-2029
4.2.3 By Type – Global Molded Interconnect Devices Revenue Market Share, 2018-2029
4.3 By Type – Global Molded Interconnect Devices Sales & Forecasts
4.3.1 By Type – Global Molded Interconnect Devices Sales, 2018-2023
4.3.2 By Type – Global Molded Interconnect Devices Sales, 2024-2029
4.3.3 By Type – Global Molded Interconnect Devices Sales Market Share, 2018-2029
4.4 By Type – Global Molded Interconnect Devices Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Molded Interconnect Devices Market Size, 2022 & 2029
5.1.2 Automotive
5.1.3 Consumer Products
5.1.4 Healthcare
5.1.5 Industrial
5.1.6 Military & Aerospace
5.1.7 Telecommunication & Computing
5.2 By Application – Global Molded Interconnect Devices Revenue & Forecasts
5.2.1 By Application – Global Molded Interconnect Devices Revenue, 2018-2023
5.2.2 By Application – Global Molded Interconnect Devices Revenue, 2024-2029
5.2.3 By Application – Global Molded Interconnect Devices Revenue Market Share, 2018-2029
5.3 By Application – Global Molded Interconnect Devices Sales & Forecasts
5.3.1 By Application – Global Molded Interconnect Devices Sales, 2018-2023
5.3.2 By Application – Global Molded Interconnect Devices Sales, 2024-2029
5.3.3 By Application – Global Molded Interconnect Devices Sales Market Share, 2018-2029
5.4 By Application – Global Molded Interconnect Devices Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
6.1 By Region – Global Molded Interconnect Devices Market Size, 2022 & 2029
6.2 By Region – Global Molded Interconnect Devices Revenue & Forecasts
6.2.1 By Region – Global Molded Interconnect Devices Revenue, 2018-2023
6.2.2 By Region – Global Molded Interconnect Devices Revenue, 2024-2029
6.2.3 By Region – Global Molded Interconnect Devices Revenue Market Share, 2018-2029
6.3 By Region – Global Molded Interconnect Devices Sales & Forecasts
6.3.1 By Region – Global Molded Interconnect Devices Sales, 2018-2023
6.3.2 By Region – Global Molded Interconnect Devices Sales, 2024-2029
6.3.3 By Region – Global Molded Interconnect Devices Sales Market Share, 2018-2029
6.4 North America
6.4.1 By Country – North America Molded Interconnect Devices Revenue, 2018-2029
6.4.2 By Country – North America Molded Interconnect Devices Sales, 2018-2029
6.4.3 US Molded Interconnect Devices Market Size, 2018-2029
6.4.4 Canada Molded Interconnect Devices Market Size, 2018-2029
6.4.5 Mexico Molded Interconnect Devices Market Size, 2018-2029
6.5 Europe
6.5.1 By Country – Europe Molded Interconnect Devices Revenue, 2018-2029
6.5.2 By Country – Europe Molded Interconnect Devices Sales, 2018-2029
6.5.3 Germany Molded Interconnect Devices Market Size, 2018-2029
6.5.4 France Molded Interconnect Devices Market Size, 2018-2029
6.5.5 U.K. Molded Interconnect Devices Market Size, 2018-2029
6.5.6 Italy Molded Interconnect Devices Market Size, 2018-2029
6.5.7 Russia Molded Interconnect Devices Market Size, 2018-2029
6.5.8 Nordic Countries Molded Interconnect Devices Market Size, 2018-2029
6.5.9 Benelux Molded Interconnect Devices Market Size, 2018-2029
6.6 Asia
6.6.1 By Region – Asia Molded Interconnect Devices Revenue, 2018-2029
6.6.2 By Region – Asia Molded Interconnect Devices Sales, 2018-2029
6.6.3 China Molded Interconnect Devices Market Size, 2018-2029
6.6.4 Japan Molded Interconnect Devices Market Size, 2018-2029
6.6.5 South Korea Molded Interconnect Devices Market Size, 2018-2029
6.6.6 Southeast Asia Molded Interconnect Devices Market Size, 2018-2029
6.6.7 India Molded Interconnect Devices Market Size, 2018-2029
6.7 South America
6.7.1 By Country – South America Molded Interconnect Devices Revenue, 2018-2029
6.7.2 By Country – South America Molded Interconnect Devices Sales, 2018-2029
6.7.3 Brazil Molded Interconnect Devices Market Size, 2018-2029
6.7.4 Argentina Molded Interconnect Devices Market Size, 2018-2029
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa Molded Interconnect Devices Revenue, 2018-2029
6.8.2 By Country – Middle East & Africa Molded Interconnect Devices Sales, 2018-2029
6.8.3 Turkey Molded Interconnect Devices Market Size, 2018-2029
6.8.4 Israel Molded Interconnect Devices Market Size, 2018-2029
6.8.5 Saudi Arabia Molded Interconnect Devices Market Size, 2018-2029
6.8.6 UAE Molded Interconnect Devices Market Size, 2018-2029
7 Manufacturers & Brands Profiles
7.1 MacDermid Enthone
7.1.1 MacDermid Enthone Company Summary
7.1.2 MacDermid Enthone Business Overview
7.1.3 MacDermid Enthone Molded Interconnect Devices Major Product Offerings
7.1.4 MacDermid Enthone Molded Interconnect Devices Sales and Revenue in Global (2018-2023)
7.1.5 MacDermid Enthone Key News & Latest Developments
7.2 Molex
7.2.1 Molex Company Summary
7.2.2 Molex Business Overview
7.2.3 Molex Molded Interconnect Devices Major Product Offerings
7.2.4 Molex Molded Interconnect Devices Sales and Revenue in Global (2018-2023)
7.2.5 Molex Key News & Latest Developments
7.3 LPKF Laser & Electronics
7.3.1 LPKF Laser & Electronics Company Summary
7.3.2 LPKF Laser & Electronics Business Overview
7.3.3 LPKF Laser & Electronics Molded Interconnect Devices Major Product Offerings
7.3.4 LPKF Laser & Electronics Molded Interconnect Devices Sales and Revenue in Global (2018-2023)
7.3.5 LPKF Laser & Electronics Key News & Latest Developments
7.4 TE Connectivity
7.4.1 TE Connectivity Company Summary
7.4.2 TE Connectivity Business Overview
7.4.3 TE Connectivity Molded Interconnect Devices Major Product Offerings
7.4.4 TE Connectivity Molded Interconnect Devices Sales and Revenue in Global (2018-2023)
7.4.5 TE Connectivity Key News & Latest Developments
7.5 Harting Mitronics AG
7.5.1 Harting Mitronics AG Company Summary
7.5.2 Harting Mitronics AG Business Overview
7.5.3 Harting Mitronics AG Molded Interconnect Devices Major Product Offerings
7.5.4 Harting Mitronics AG Molded Interconnect Devices Sales and Revenue in Global (2018-2023)
7.5.5 Harting Mitronics AG Key News & Latest Developments
7.6 SelectConnect Technologies
7.6.1 SelectConnect Technologies Company Summary
7.6.2 SelectConnect Technologies Business Overview
7.6.3 SelectConnect Technologies Molded Interconnect Devices Major Product Offerings
7.6.4 SelectConnect Technologies Molded Interconnect Devices Sales and Revenue in Global (2018-2023)
7.6.5 SelectConnect Technologies Key News & Latest Developments
7.7 RTP company
7.7.1 RTP company Company Summary
7.7.2 RTP company Business Overview
7.7.3 RTP company Molded Interconnect Devices Major Product Offerings
7.7.4 RTP company Molded Interconnect Devices Sales and Revenue in Global (2018-2023)
7.7.5 RTP company Key News & Latest Developments
8 Global Molded Interconnect Devices Production Capacity, Analysis
8.1 Global Molded Interconnect Devices Production Capacity, 2018-2029
8.2 Molded Interconnect Devices Production Capacity of Key Manufacturers in Global Market
8.3 Global Molded Interconnect Devices Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 Molded Interconnect Devices Supply Chain Analysis
10.1 Molded Interconnect Devices Industry Value Chain
10.2 Molded Interconnect Devices Upstream Market
10.3 Molded Interconnect Devices Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 Molded Interconnect Devices Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 Disclaimer
世界の成形回路部品市場予測2023-2029：レーザー直接構造化（LDS）、2ショット成形、その他 |
| 【英語タイトル】Molded Interconnect Devices Market, Global Outlook and Forecast 2023-2029 | |
 | ・商品コード：MMG23JU4346 ・発行会社（調査会社）：Market Monitor Global ・発行日：2023年6月 ・ページ数：74 ・レポート言語：英語 ・レポート形式：PDF ・納品方法：Eメール（受注後2-3営業日） ・調査対象地域：グローバル、北米、アメリカ、ヨーロッパ、アジア、日本、中国、東南アジア、インド、南米、中東・アフリカなど ・産業分野：機械&装置 |
| Single User（1名様閲覧用） | USD3,250 ⇒換算￥494,000 | 見積依頼/購入/質問フォーム |
| Multi User（20名様閲覧用） | USD4,225 ⇒換算￥642,200 | 見積依頼/購入/質問フォーム |
| Enterprise User（閲覧人数制限なし） | USD4,875 ⇒換算￥741,000 | 見積依頼/購入/質問フォーム |
|
※販売価格オプションの説明 ※お支払金額：換算金額（日本円）＋消費税 ※納期：即日〜2営業日（3日以上かかる場合は別途表記又はご連絡） ※お支払方法：納品日＋5日以内に請求書を発行・送付（請求書発行日より2ヶ月以内に銀行振込、振込先：三菱UFJ銀行/H&Iグローバルリサーチ株式会社、支払期限と方法は調整可能） |
| 当調査レポートは次の情報を含め、世界の成形回路部品市場規模と予測を収録しています。・世界の成形回路部品市場：売上、2018年-2023年、2024年-2029年 ・世界の成形回路部品市場：販売量、2018年-2023年、2024年-2029年 ・世界のトップ5企業、2022年 世界の成形回路部品市場は2022年に000Mドルと評価され、予測期間中に000％のCAGRで2029年までに000Mドルに達すると予測されています。米国市場は2022年に000Mドルと推定されており、中国は2029年までに000Mドルに達すると予測されています。「レーザー直接構造化（LDS）」セグメントは今後6年間、000%のCAGRで2029年までに000Mドルに成長すると予測されています。 成形回路部品のグローバル主要企業は、MacDermid Enthone、 Molex、 LPKF Laser & Electronics、 TE Connectivity、 Harting Mitronics AG、 SelectConnect Technologies、 RTP companyなどです。2022年にトップ5企業がグローバル売上シェアの約000%を占めています。 MARKET MONITOR GLOBAL（MMG）は、成形回路部品のメーカー、サプライヤー、流通業者、および業界の専門家を調査しました。これには、販売量、売上、需要、価格変動、製品タイプ、最近の動向と計画、産業トレンド、成長要因、課題、阻害要因、潜在的なリスクなどが含まれます。 【セグメント別市場分析】 世界の成形回路部品市場：タイプ別、2018年-2023年、2024年-2029年 世界の成形回路部品市場：タイプ別市場シェア、2022年 ・レーザー直接構造化（LDS）、2ショット成形、その他 世界の成形回路部品市場：用途別、2018年-2023年、2024年-2029年 世界の成形回路部品市場：用途別市場シェア、2022年 ・自動車、消費者製品、医療、工業、軍事・航空宇宙、通信・コンピューティング 世界の成形回路部品市場：地域・国別、2018年-2023年、2024年-2029年 世界の成形回路部品市場：地域別市場シェア、2022年 ・北米：アメリカ、カナダ、メキシコ ・ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア ・アジア：中国、日本、韓国、東南アジア、インド ・南米：ブラジル、アルゼンチン ・中東・アフリカ：トルコ、イスラエル、サウジアラビア、UAE 【競合分析】 また、当レポートは主要な市場参加者の分析を提供します。 ・主要企業における成形回路部品のグローバル売上、2018年-2023年 ・主要企業における成形回路部品のグローバル売上シェア、2022年 ・主要企業における成形回路部品のグローバル販売量、2018年-2023年 ・主要企業における成形回路部品のグローバル販売量シェア、2022年 さらに、当レポートは主要企業のプロファイルを提示します。 MacDermid Enthone、 Molex、 LPKF Laser & Electronics、 TE Connectivity、 Harting Mitronics AG、 SelectConnect Technologies、 RTP company ************************************************************* ・調査・分析レポートの概要 成形回路部品市場の定義 市場セグメント 世界の成形回路部品市場概要 当レポートの特徴・ベネフィット 調査手法と情報源 ・世界の成形回路部品市場規模 世界の成形回路部品市場規模：2022年 VS 2029年 世界の成形回路部品市場規模と予測 2018年-2029年 ・競争状況 グローバルトップ企業 売上ベースでのグローバルトップ企業 企業別グローバルでの成形回路部品の売上 グローバルトップ3およびトップ5企業、2022年売上ベース グローバル企業の成形回路部品製品タイプ グローバルにおけるティア1、ティア2、ティア3企業 ・タイプ別市場分析 タイプ区分：レーザー直接構造化（LDS）、2ショット成形、その他 成形回路部品のタイプ別グローバル売上・予測 ・用途別市場分析 用途区分：自動車、消費者製品、医療、工業、軍事・航空宇宙、通信・コンピューティング 成形回路部品の用途別グローバル売上・予測 ・地域別市場分析 地域別成形回路部品市場規模 2022年と2029年 地域別成形回路部品売上・予測 北米市場：アメリカ、カナダ、メキシコ ヨーロッパ市場：ドイツ、フランス、イギリス、イタリア、ロシア アジア市場：中国、日本、韓国、東南アジア、インド 南米市場：ブラジル、アルゼンチン 中東・アフリカ市場：トルコ、イスラエル、サウジアラビア、UAE ・主要企業のプロファイル（企業概要、事業概要、主要製品、売上、ニュースなど） MacDermid Enthone、 Molex、 LPKF Laser & Electronics、 TE Connectivity、 Harting Mitronics AG、 SelectConnect Technologies、 RTP company ... |
The molded interconnect devices market is likely to exhibit growth over the forecast period owing to frequent technological advancements in telecommunication and consumer product applications. Rising proliferation of smartphones and surge in adoption of smart wearable devices are expected to offer stimulus to the industry growth. MID combines with various other internal parts such as connectors, circuit boards, and cables, among others, improving the circuit density and eliminating various combinations of components as in the case of PCB circuits.
This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Devices, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Devices. This report contains market size and forecasts of Molded Interconnect Devices in global, including the following market information:
Global Molded Interconnect Devices Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Molded Interconnect Devices Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Molded Interconnect Devices companies in 2022 (%)
The global Molded Interconnect Devices market was valued at US$ 1179.8 million in 2022 and is projected to reach US$ 2537.3 million by 2029, at a CAGR of 11.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Laser Direct Structuring (LDS) Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Molded Interconnect Devices include MacDermid Enthone, Molex, LPKF Laser & Electronics, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies and RTP company, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Molded Interconnect Devices manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Molded Interconnect Devices Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Molded Interconnect Devices Market Segment Percentages, by Type, 2022 (%)
Laser Direct Structuring (LDS)
Two-Shot Molding
Others
Global Molded Interconnect Devices Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Molded Interconnect Devices Market Segment Percentages, by Application, 2022 (%)
Automotive
Consumer Products
Healthcare
Industrial
Military & Aerospace
Telecommunication & Computing
Global Molded Interconnect Devices Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Molded Interconnect Devices Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Molded Interconnect Devices revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Molded Interconnect Devices revenues share in global market, 2022 (%)
Key companies Molded Interconnect Devices sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Molded Interconnect Devices sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
MacDermid Enthone
Molex
LPKF Laser & Electronics
TE Connectivity
Harting Mitronics AG
SelectConnect Technologies
RTP company
Outline of Major Chapters:
Chapter 1: Introduces the definition of Molded Interconnect Devices, market overview.
Chapter 2: Global Molded Interconnect Devices market size in revenue and volume.
Chapter 3: Detailed analysis of Molded Interconnect Devices manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Molded Interconnect Devices in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Molded Interconnect Devices capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
❖ レポートの目次 ❖
| ★調査レポート[世界の成形回路部品市場予測2023-2029：レーザー直接構造化（LDS）、2ショット成形、その他] (コード：MMG23JU4346)販売に関する免責事項を必ずご確認ください。 |
| ★調査レポート[世界の成形回路部品市場予測2023-2029：レーザー直接構造化（LDS）、2ショット成形、その他]についてメールでお問い合わせ |
