1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Semiconductor Packaging Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Type
6.1 Flip Chip
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Embedded DIE
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 Fan-in WLP
6.3.1 Market Trends
6.3.2 Market Forecast
6.4 Fan-out WLP
6.4.1 Market Trends
6.4.2 Market Forecast
7 Market Breakup by Packaging Material
7.1 Organic Substrate
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Bonding Wire
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Leadframe
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Ceramic Package
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Die Attach Material
7.5.1 Market Trends
7.5.2 Market Forecast
7.6 Others
7.6.1 Market Trends
7.6.2 Market Forecast
8 Market Breakup by Technology
8.1 Grid Array
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Small Outline Package
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Flat no-leads Package
8.3.1 Market Trends
8.3.2 Market Forecast
8.4 Dual In-Line Package
8.4.1 Market Trends
8.4.2 Market Forecast
8.5 Others
8.5.1 Market Trends
8.5.2 Market Forecast
9 Market Breakup by End User
9.1 Consumer Electronics
9.1.1 Market Trends
9.1.2 Market Forecast
9.2 Automotive
9.2.1 Market Trends
9.2.2 Market Forecast
9.3 Healthcare
9.3.1 Market Trends
9.3.2 Market Forecast
9.4 IT and Telecommunication
9.4.1 Market Trends
9.4.2 Market Forecast
9.5 Aerospace and Defense
9.5.1 Market Trends
9.5.2 Market Forecast
9.6 Others
9.6.1 Market Trends
9.6.2 Market Forecast
10 Market Breakup by Region
10.1 North America
10.1.1 United States
10.1.1.1 Market Trends
10.1.1.2 Market Forecast
10.1.2 Canada
10.1.2.1 Market Trends
10.1.2.2 Market Forecast
10.2 Asia-Pacific
10.2.1 China
10.2.1.1 Market Trends
10.2.1.2 Market Forecast
10.2.2 Japan
10.2.2.1 Market Trends
10.2.2.2 Market Forecast
10.2.3 India
10.2.3.1 Market Trends
10.2.3.2 Market Forecast
10.2.4 South Korea
10.2.4.1 Market Trends
10.2.4.2 Market Forecast
10.2.5 Australia
10.2.5.1 Market Trends
10.2.5.2 Market Forecast
10.2.6 Indonesia
10.2.6.1 Market Trends
10.2.6.2 Market Forecast
10.2.7 Others
10.2.7.1 Market Trends
10.2.7.2 Market Forecast
10.3 Europe
10.3.1 Germany
10.3.1.1 Market Trends
10.3.1.2 Market Forecast
10.3.2 France
10.3.2.1 Market Trends
10.3.2.2 Market Forecast
10.3.3 United Kingdom
10.3.3.1 Market Trends
10.3.3.2 Market Forecast
10.3.4 Italy
10.3.4.1 Market Trends
10.3.4.2 Market Forecast
10.3.5 Spain
10.3.5.1 Market Trends
10.3.5.2 Market Forecast
10.3.6 Russia
10.3.6.1 Market Trends
10.3.6.2 Market Forecast
10.3.7 Others
10.3.7.1 Market Trends
10.3.7.2 Market Forecast
10.4 Latin America
10.4.1 Brazil
10.4.1.1 Market Trends
10.4.1.2 Market Forecast
10.4.2 Mexico
10.4.2.1 Market Trends
10.4.2.2 Market Forecast
10.4.3 Others
10.4.3.1 Market Trends
10.4.3.2 Market Forecast
10.5 Middle East and Africa
10.5.1 Market Trends
10.5.2 Market Breakup by Country
10.5.3 Market Forecast
11 SWOT Analysis
11.1 Overview
11.2 Strengths
11.3 Weaknesses
11.4 Opportunities
11.5 Threats
12 Value Chain Analysis
13 Porters Five Forces Analysis
13.1 Overview
13.2 Bargaining Power of Buyers
13.3 Bargaining Power of Suppliers
13.4 Degree of Competition
13.5 Threat of New Entrants
13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
15.1 Market Structure
15.2 Key Players
15.3 Profiles of Key Players
15.3.1 Amkor Technology Inc.
15.3.1.1 Company Overview
15.3.1.2 Product Portfolio
15.3.1.3 Financials
15.3.1.4 SWOT Analysis
15.3.2 ASE Group
15.3.2.1 Company Overview
15.3.2.2 Product Portfolio
15.3.2.3 Financials
15.3.3 ChipMOS Technologies Inc.
15.3.3.1 Company Overview
15.3.3.2 Product Portfolio
15.3.3.3 Financials
15.3.4 Fujitsu Limited
15.3.4.1 Company Overview
15.3.4.2 Product Portfolio
15.3.4.3 Financials
15.3.4.4 SWOT Analysis
15.3.5 Intel Corporation
15.3.5.1 Company Overview
15.3.5.2 Product Portfolio
15.3.5.3 Financials
15.3.5.4 SWOT Analysis
15.3.6 International Business Machines Corporation
15.3.6.1 Company Overview
15.3.6.2 Product Portfolio
15.3.6.3 Financials
15.3.6.4 SWOT Analysis
15.3.7 Jiangsu Changjiang Electronics Technology Co., Ltd.
15.3.7.1 Company Overview
15.3.7.2 Product Portfolio
15.3.7.3 Financials
15.3.8 Powertech Technology Inc.
15.3.8.1 Company Overview
15.3.8.2 Product Portfolio
15.3.8.3 Financials
15.3.8.4 SWOT Analysis
15.3.9 Qualcomm Incorporated
15.3.9.1 Company Overview
15.3.9.2 Product Portfolio
15.3.9.3 Financials
15.3.9.4 SWOT Analysis
15.3.10 Samsung Electronics Co. Ltd.
15.3.10.1 Company Overview
15.3.10.2 Product Portfolio
15.3.10.3 Financials
15.3.10.4 SWOT Analysis
15.3.11 STMicroelectronics International N.V.
15.3.11.1 Company Overview
15.3.11.2 Product Portfolio
15.3.11.3 Financials
15.3.11.4 SWOT Analysis
15.3.12 Taiwan Semiconductor Manufacturing Company Limited
15.3.12.1 Company Overview
15.3.12.2 Product Portfolio
15.3.12.3 Financials
15.3.12.4 SWOT Analysis
15.3.13 Texas Instruments Incorporated
15.3.13.1 Company Overview
15.3.13.2 Product Portfolio
15.3.13.3 Financials
15.3.13.4 SWOT Analysis
世界の半導体パッケージ市場予測2023年-2028年 |
| 【英語タイトル】Semiconductor Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028 | |
 | ・商品コード：IMARC23AP055 ・発行会社（調査会社）：IMARC ・発行日：2023年2月21日 ・ページ数：151 ・レポート言語：英語 ・レポート形式：PDF ・納品方法：Eメール ・調査対象地域：グローバル ・産業分野：半導体 |
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| IMARC社の本調査レポートでは、2022年に324億ドルであった世界の半導体パッケージ市場規模が、2028年までに517億ドルに拡大し、予測期間中にCAGR7.78%で成長すると予想しています。本書は、半導体パッケージの世界市場を調査・分析し、序論、範囲・調査手法、エグゼクティブサマリー、イントロダクション、種類別（フリップチップ、埋め込み型ダイ、ファンイン型WLP、ファンアウト型WLP）分析、パッケージ材料別（有機基材、結合線、リードフレーム、セラミックパッケージ、その他）分析、技術別（グリッドアレイ、小型アウトラインパッケージ、フラットノーリードパッケージ、デュアルインラインパッケージ、その他）分析、エンドユーザー別（家電、自動車、医療、IT・通信、その他）分析、地域別（北米、アジア太平洋、ヨーロッパ、中南米、中東・アフリカ）分析、SWOT分析、バリューチェーン分析、ポーターズファイブフォース分析、価格分析、競争状況などの項目を整理しています。また、本書には、Amkor Technology Inc.、ASE Group、ChipMOS Technologies Inc.、Fujitsu Limited、Intel Corporation、International Business Machines Corporation、Jiangsu Changjiang Electronics Technology Co.、Ltd.、Powertech Technology Inc.、Qualcomm Incorporated、Samsung Electronics Co. Ltdなどの企業情報が含まれています。 ・序論 ・範囲・調査手法 ・エグゼクティブサマリー ・イントロダクション ・世界の半導体パッケージ市場規模：種類別 - フリップチップの市場規模 - 埋め込み型ダイの市場規模 - ファンイン型WLPの市場規模 - ファンアウト型WLPの市場規模 ・世界の半導体パッケージ市場規模：パッケージ材料別 - 有機基材の市場規模 - 結合線の市場規模 - リードフレームの市場規模 - セラミックパッケージの市場規模 - その他の市場規模 ・世界の半導体パッケージ市場規模：技術別 - グリッドアレイの市場規模 - 小型アウトラインパッケージの市場規模 - フラットノーリードパッケージの市場規模 - デュアルインラインパッケージの市場規模 - その他の市場規模 ・世界の半導体パッケージ市場規模：エンドユーザー別 - 家電における市場規模 - 自動車における市場規模 - 医療における市場規模 - IT・通信における市場規模 - その他における市場規模 ・世界の半導体パッケージ市場規模：地域別 - 北米の半導体パッケージ市場規模 - アジア太平洋の半導体パッケージ市場規模 - ヨーロッパの半導体パッケージ市場規模 - 中南米の半導体パッケージ市場規模 - 中東・アフリカの半導体パッケージ市場規模 ・SWOT分析 ・バリューチェーン分析 ・ポーターズファイブフォース分析 ・価格分析 ・競争状況 |
The global semiconductor packaging market size reached US$ 32.4 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 51.7 Billion by 2028, exhibiting a growth rate (CAGR) of 7.78% during 2023-2028.
Semiconductor packaging is a container used for protecting the integrated circuit (IC) chips from surrounding environments and houses one or more discrete and fragile semiconductor components. Embedded die, flip chip, fan-in wafer-level and fan-out wafer-level packaging are some of the commonly available semiconductor packaging variants that are manufactured using plastic, glass and metallic materials. They are widely used to provide a supporting case that prevents physical damage and corrosion to logic units, silicon wafers and memory devices during the final stage of the semiconductor manufacturing process. Semiconductor packaging also aids in protecting the electronic system from radiofrequency noise emission, cooling, electrostatic discharge and mechanical damage. As a result, it finds extensive application across various industries, such as automotive, medical, telecommunications, aerospace and defense.
Semiconductor Packaging Market Trends:
The widespread product utilization in the consumer electronics industry is one of the key factors driving the growth of the market. Semiconductors are widely used in lightweight, small and portable devices, such as smartphones, tablets, smartwatches, fitness bands and communication devices. Additionally, significant growth in the automotive industry is favoring the market growth. Semiconductor ICs are widely used in various products, such as anti-lock braking systems (ABS), infotainment, airbag control, collision detection technology and windows. Moreover, the increasing utilization of artificial intelligence (AI) and Internet of Things (IoT)-integrated industrial devices with high power requirements is also enhancing the demand for semiconductor packaging. In line with this, rising environmental consciousness among the masses and the increasing need for reducing electronic waste is positively impacting the market growth. Other factors, including the widespread product adoption in the aerospace industry to improve the thermal performance of the aircraft components, along with the increasing demand for semiconductor packaging in medical devices, such as ultrasound devices, mobile X-ray systems and patient monitors, are anticipated to drive the market toward growth.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type, packaging material, technology and end user.
Breakup by Type:
Flip Chip
Embedded DIE
Fan-in WLP
Fan-out WLP
Breakup by Packaging Material:
Organic Substrate
Bonding Wire
Leadframe
Ceramic Package
Die Attach Material
Others
Breakup by Technology:
Grid Array
Small Outline Package
Flat no-leads Package
Dual In-Line Package
Others
Breakup by End User:
Consumer Electronics
Automotive
Healthcare
IT and Telecommunication
Aerospace and Defense
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Group, ChipMOS Technologies Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Powertech Technology Inc., Qualcomm Incorporated, Samsung Electronics Co. Ltd., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company Limited, and Texas Instruments Incorporated.
Key Questions Answered in This Report:
How has the global semiconductor packaging market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global semiconductor packaging market?
What are the key regional markets?
What is the breakup of the market based on the type?
What is the breakup of the market based on the packaging material?
What is the breakup of the market based on the technology?
What is the breakup of the market based on the end user?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global semiconductor packaging market and who are the key players?
What is the degree of competition in the industry?
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