CHAPTER 1:INTRODUCTION
1.1.Report description
1.2.Key market segments
1.3.Key benefits to the stakeholders
1.4.Research Methodology
1.4.1.Secondary research
1.4.2.Primary research
1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
2.1.Key findings of the study
2.2.CXO Perspective
CHAPTER 3:MARKET OVERVIEW
3.1.Market definition and scope
3.2.Key findings
3.2.1.Top investment pockets
3.3.Porter’s five forces analysis
3.4.Top player positioning
3.5.Market dynamics
3.5.1.Drivers
3.5.2.Restraints
3.5.3.Opportunities
3.6.COVID-19 Impact Analysis on the market
3.7.Value Chain Analysis
3.8.Key Regulation Analysis
3.9.Patent Landscape
3.10.Regulatory Guidelines
3.11.Market Share Analysis
CHAPTER 4: 3D SENSOR MARKET, BY TYPE
4.1 Overview
4.1.1 Market size and forecast
4.2 Image Sensor
4.2.1 Key market trends, growth factors and opportunities
4.2.2 Market size and forecast, by region
4.2.3 Market analysis by country
4.3 Accelerometer Sensor
4.3.1 Key market trends, growth factors and opportunities
4.3.2 Market size and forecast, by region
4.3.3 Market analysis by country
4.4 Position Sensor
4.4.1 Key market trends, growth factors and opportunities
4.4.2 Market size and forecast, by region
4.4.3 Market analysis by country
4.5 Others
4.5.1 Key market trends, growth factors and opportunities
4.5.2 Market size and forecast, by region
4.5.3 Market analysis by country
CHAPTER 5: 3D SENSOR MARKET, BY TECHNOLOGY
5.1 Overview
5.1.1 Market size and forecast
5.2 Structured Light
5.2.1 Key market trends, growth factors and opportunities
5.2.2 Market size and forecast, by region
5.2.3 Market analysis by country
5.3 Time of Flight
5.3.1 Key market trends, growth factors and opportunities
5.3.2 Market size and forecast, by region
5.3.3 Market analysis by country
5.4 Stereoscopic Vision
5.4.1 Key market trends, growth factors and opportunities
5.4.2 Market size and forecast, by region
5.4.3 Market analysis by country
5.5 Ultrasound
5.5.1 Key market trends, growth factors and opportunities
5.5.2 Market size and forecast, by region
5.5.3 Market analysis by country
5.6 Others
5.6.1 Key market trends, growth factors and opportunities
5.6.2 Market size and forecast, by region
5.6.3 Market analysis by country
CHAPTER 6: 3D SENSOR MARKET, BY CONNECTIVITY
6.1 Overview
6.1.1 Market size and forecast
6.2 Wireless
6.2.1 Key market trends, growth factors and opportunities
6.2.2 Market size and forecast, by region
6.2.3 Market analysis by country
6.3 Wired
6.3.1 Key market trends, growth factors and opportunities
6.3.2 Market size and forecast, by region
6.3.3 Market analysis by country
CHAPTER 7: 3D SENSOR MARKET, BY END USE
7.1 Overview
7.1.1 Market size and forecast
7.2 Consumer Electronics
7.2.1 Key market trends, growth factors and opportunities
7.2.2 Market size and forecast, by region
7.2.3 Market analysis by country
7.3 Healthcare
7.3.1 Key market trends, growth factors and opportunities
7.3.2 Market size and forecast, by region
7.3.3 Market analysis by country
7.4 Aerospace & Defense
7.4.1 Key market trends, growth factors and opportunities
7.4.2 Market size and forecast, by region
7.4.3 Market analysis by country
7.5 Automotive
7.5.1 Key market trends, growth factors and opportunities
7.5.2 Market size and forecast, by region
7.5.3 Market analysis by country
7.6 Others
7.6.1 Key market trends, growth factors and opportunities
7.6.2 Market size and forecast, by region
7.6.3 Market analysis by country
CHAPTER 8: 3D SENSOR MARKET, BY REGION
8.1 Overview
8.1.1 Market size and forecast
8.2 North America
8.2.1 Key trends and opportunities
8.2.2 North America Market size and forecast, by Type
8.2.3 North America Market size and forecast, by Technology
8.2.4 North America Market size and forecast, by Connectivity
8.2.5 North America Market size and forecast, by End use
8.2.6 North America Market size and forecast, by country
8.2.6.1 U.S.
8.2.6.1.1 Market size and forecast, by Type
8.2.6.1.2 Market size and forecast, by Technology
8.2.6.1.3 Market size and forecast, by Connectivity
8.2.6.1.4 Market size and forecast, by End use
8.2.6.2 Canada
8.2.6.2.1 Market size and forecast, by Type
8.2.6.2.2 Market size and forecast, by Technology
8.2.6.2.3 Market size and forecast, by Connectivity
8.2.6.2.4 Market size and forecast, by End use
8.2.6.3 Mexico
8.2.6.3.1 Market size and forecast, by Type
8.2.6.3.2 Market size and forecast, by Technology
8.2.6.3.3 Market size and forecast, by Connectivity
8.2.6.3.4 Market size and forecast, by End use
8.3 Europe
8.3.1 Key trends and opportunities
8.3.2 Europe Market size and forecast, by Type
8.3.3 Europe Market size and forecast, by Technology
8.3.4 Europe Market size and forecast, by Connectivity
8.3.5 Europe Market size and forecast, by End use
8.3.6 Europe Market size and forecast, by country
8.3.6.1 Germany
8.3.6.1.1 Market size and forecast, by Type
8.3.6.1.2 Market size and forecast, by Technology
8.3.6.1.3 Market size and forecast, by Connectivity
8.3.6.1.4 Market size and forecast, by End use
8.3.6.2 UK
8.3.6.2.1 Market size and forecast, by Type
8.3.6.2.2 Market size and forecast, by Technology
8.3.6.2.3 Market size and forecast, by Connectivity
8.3.6.2.4 Market size and forecast, by End use
8.3.6.3 France
8.3.6.3.1 Market size and forecast, by Type
8.3.6.3.2 Market size and forecast, by Technology
8.3.6.3.3 Market size and forecast, by Connectivity
8.3.6.3.4 Market size and forecast, by End use
8.3.6.4 Spain
8.3.6.4.1 Market size and forecast, by Type
8.3.6.4.2 Market size and forecast, by Technology
8.3.6.4.3 Market size and forecast, by Connectivity
8.3.6.4.4 Market size and forecast, by End use
8.3.6.5 Italy
8.3.6.5.1 Market size and forecast, by Type
8.3.6.5.2 Market size and forecast, by Technology
8.3.6.5.3 Market size and forecast, by Connectivity
8.3.6.5.4 Market size and forecast, by End use
8.3.6.6 Rest of Europe
8.3.6.6.1 Market size and forecast, by Type
8.3.6.6.2 Market size and forecast, by Technology
8.3.6.6.3 Market size and forecast, by Connectivity
8.3.6.6.4 Market size and forecast, by End use
8.4 Asia-Pacific
8.4.1 Key trends and opportunities
8.4.2 Asia-Pacific Market size and forecast, by Type
8.4.3 Asia-Pacific Market size and forecast, by Technology
8.4.4 Asia-Pacific Market size and forecast, by Connectivity
8.4.5 Asia-Pacific Market size and forecast, by End use
8.4.6 Asia-Pacific Market size and forecast, by country
8.4.6.1 China
8.4.6.1.1 Market size and forecast, by Type
8.4.6.1.2 Market size and forecast, by Technology
8.4.6.1.3 Market size and forecast, by Connectivity
8.4.6.1.4 Market size and forecast, by End use
8.4.6.2 Japan
8.4.6.2.1 Market size and forecast, by Type
8.4.6.2.2 Market size and forecast, by Technology
8.4.6.2.3 Market size and forecast, by Connectivity
8.4.6.2.4 Market size and forecast, by End use
8.4.6.3 India
8.4.6.3.1 Market size and forecast, by Type
8.4.6.3.2 Market size and forecast, by Technology
8.4.6.3.3 Market size and forecast, by Connectivity
8.4.6.3.4 Market size and forecast, by End use
8.4.6.4 South Korea
8.4.6.4.1 Market size and forecast, by Type
8.4.6.4.2 Market size and forecast, by Technology
8.4.6.4.3 Market size and forecast, by Connectivity
8.4.6.4.4 Market size and forecast, by End use
8.4.6.5 Australia
8.4.6.5.1 Market size and forecast, by Type
8.4.6.5.2 Market size and forecast, by Technology
8.4.6.5.3 Market size and forecast, by Connectivity
8.4.6.5.4 Market size and forecast, by End use
8.4.6.6 Rest Of Asia Pacific
8.4.6.6.1 Market size and forecast, by Type
8.4.6.6.2 Market size and forecast, by Technology
8.4.6.6.3 Market size and forecast, by Connectivity
8.4.6.6.4 Market size and forecast, by End use
8.5 LAMEA
8.5.1 Key trends and opportunities
8.5.2 LAMEA Market size and forecast, by Type
8.5.3 LAMEA Market size and forecast, by Technology
8.5.4 LAMEA Market size and forecast, by Connectivity
8.5.5 LAMEA Market size and forecast, by End use
8.5.6 LAMEA Market size and forecast, by country
8.5.6.1 Brazil
8.5.6.1.1 Market size and forecast, by Type
8.5.6.1.2 Market size and forecast, by Technology
8.5.6.1.3 Market size and forecast, by Connectivity
8.5.6.1.4 Market size and forecast, by End use
8.5.6.2 Saudi Arabia
8.5.6.2.1 Market size and forecast, by Type
8.5.6.2.2 Market size and forecast, by Technology
8.5.6.2.3 Market size and forecast, by Connectivity
8.5.6.2.4 Market size and forecast, by End use
8.5.6.3 UAE
8.5.6.3.1 Market size and forecast, by Type
8.5.6.3.2 Market size and forecast, by Technology
8.5.6.3.3 Market size and forecast, by Connectivity
8.5.6.3.4 Market size and forecast, by End use
8.5.6.4 South Africa
8.5.6.4.1 Market size and forecast, by Type
8.5.6.4.2 Market size and forecast, by Technology
8.5.6.4.3 Market size and forecast, by Connectivity
8.5.6.4.4 Market size and forecast, by End use
8.5.6.5 Rest of LAMEA
8.5.6.5.1 Market size and forecast, by Type
8.5.6.5.2 Market size and forecast, by Technology
8.5.6.5.3 Market size and forecast, by Connectivity
8.5.6.5.4 Market size and forecast, by End use
CHAPTER 9: COMPANY LANDSCAPE
9.1. Introduction
9.2. Top winning strategies
9.3. Product Mapping of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
9.6. Key developments
CHAPTER 10: COMPANY PROFILES
10.1 Omnivision Technologies
10.1.1 Company overview
10.1.2 Company snapshot
10.1.3 Operating business segments
10.1.4 Product portfolio
10.1.5 Business performance
10.1.6 Key strategic moves and developments
10.2 Infineon Technologies
10.2.1 Company overview
10.2.2 Company snapshot
10.2.3 Operating business segments
10.2.4 Product portfolio
10.2.5 Business performance
10.2.6 Key strategic moves and developments
10.3 LMI Technologies
10.3.1 Company overview
10.3.2 Company snapshot
10.3.3 Operating business segments
10.3.4 Product portfolio
10.3.5 Business performance
10.3.6 Key strategic moves and developments
10.4 PrimeSense
10.4.1 Company overview
10.4.2 Company snapshot
10.4.3 Operating business segments
10.4.4 Product portfolio
10.4.5 Business performance
10.4.6 Key strategic moves and developments
10.5 Cognex Corporation
10.5.1 Company overview
10.5.2 Company snapshot
10.5.3 Operating business segments
10.5.4 Product portfolio
10.5.5 Business performance
10.5.6 Key strategic moves and developments
10.6 SoftKinetic
10.6.1 Company overview
10.6.2 Company snapshot
10.6.3 Operating business segments
10.6.4 Product portfolio
10.6.5 Business performance
10.6.6 Key strategic moves and developments
10.7 Pmdtechnologies GmbH
10.7.1 Company overview
10.7.2 Company snapshot
10.7.3 Operating business segments
10.7.4 Product portfolio
10.7.5 Business performance
10.7.6 Key strategic moves and developments
10.8 IFM Electronic
10.8.1 Company overview
10.8.2 Company snapshot
10.8.3 Operating business segments
10.8.4 Product portfolio
10.8.5 Business performance
10.8.6 Key strategic moves and developments
10.9 Occipital Inc.
10.9.1 Company overview
10.9.2 Company snapshot
10.9.3 Operating business segments
10.9.4 Product portfolio
10.9.5 Business performance
10.9.6 Key strategic moves and developments
世界の3Dセンサー市場2021年-2031年：種類別（画像センサー、加速度計センサー、位置センサー、その他）、技術別（立体照明、タイムオブフライト、立体視、超音波、その他）、接続別（無線、有線）、エンドユーザー別（家電、医療、航空宇宙・防衛、自動車、その他） |
| 【英語タイトル】3D Sensor Market By Type (Image Sensor, Accelerometer Sensor, Position Sensor, Others), By Technology (Structured Light, Time of Flight, Stereoscopic Vision, Ultrasound, Others), By Connectivity (Wireless, Wired), By End use (Consumer Electronics, Healthcare, Aerospace & Defense, Automotive, Others): Global Opportunity Analysis and Industry Forecast, 2021-2031 | |
 | ・商品コード：ALD23FB037 ・発行会社（調査会社）：Allied Market Research ・発行日：2022年10月 ・ページ数：360 ・レポート言語：英語 ・レポート形式：PDF ・納品方法：Eメール（受注後24時間以内） ・調査対象地域：グローバル ・産業分野：半導体＆電子 |
| Online Only（1名閲覧、印刷不可） | USD3,570 ⇒換算￥542,640 | 見積依頼/購入/質問フォーム |
| Single User（1名閲覧） | USD5,730 ⇒換算￥870,960 | 見積依頼/購入/質問フォーム |
| Enterprise User（閲覧人数無制限） | USD9,600 ⇒換算￥1,459,200 | 見積依頼/購入/質問フォーム |
|
※販売価格オプションの説明 ※お支払金額：換算金額（日本円）＋消費税 ※納期：即日〜2営業日（3日以上かかる場合は別途表記又はご連絡） ※お支払方法：納品日＋5日以内に請求書を発行・送付（請求書発行日より2ヶ月以内に銀行振込、振込先：三菱UFJ銀行/H&Iグローバルリサーチ株式会社、支払期限と方法は調整可能） |
| Allied Market Research社の市場調査では、2021年に17,607.90百万ドルであった世界の3Dセンサー市場規模が2031年には56,992.30百万ドルへ達し、2022年から2031年の間に年平均13％成長すると予測されています。当調査資料では3Dセンサーの世界市場について総合的に調査・分析し、イントロダクション、エグゼクティブサマリー、市場概要、種類別（画像センサー、加速度計センサー、位置センサー、その他）分析、技術別（立体照明、タイムオブフライト、立体視、超音波、その他）分析、接続別（無線、有線）分析、エンドユーザー別（家電、医療、航空宇宙・防衛、自動車、その他）分析、地域別（北米、ヨーロッパ、アジア太平洋、中南米/中東・アフリカ）分析、企業状況、企業情報などの項目を記載しています。また、当書にはOmnivision Technologies、Infineon Technologies、LMI Technologies、PrimeSense、Cognex Corporation、SoftKinetic、Pmdtechnologies GmbH、IFM Electronic、Occipital Inc.などの企業情報が含まれています。 ・イントロダクション ・エグゼクティブサマリー ・市場概要 ・世界の3Dセンサー市場規模：種類別 - 画像センサーの市場規模 - 加速度計センサーの市場規模 - 位置センサーの市場規模 - その他3Dセンサーの市場規模 ・世界の3Dセンサー市場規模：技術別 - 立体照明3Dセンサーの市場規模 - タイムオブフライト法3Dセンサーの市場規模 - 立体視3Dセンサーの市場規模 - 超音波3Dセンサーの市場規模 - その他3Dセンサーの市場規模 ・世界の3Dセンサー市場規模：接続別 - 無線式3Dセンサーの市場規模 - 有線式3Dセンサーの市場規模 ・世界の3Dセンサー市場規模：エンドユーザー別 - 家電における市場規模 - 医療における市場規模 - 航空宇宙・防衛における市場規模 - 自動車における市場規模 - その他エンドユーザーにおける市場規模 ・世界の3Dセンサー市場規模：地域別 - 北米の3Dセンサー市場規模 - ヨーロッパの3Dセンサー市場規模 - アジア太平洋の3Dセンサー市場規模 - 中南米/中東・アフリカの3Dセンサー市場規模 ・企業状況 ・企業情報 |
The global 3D sensor market is envisioned to garner $56,992.30 million by 2031, growing from $17,607.90 million in 2021 at a CAGR of 13.0% from 2022 to 2031.
The development of three-dimensional (3D) technology is a significant scientific breakthrough. It is a depth-sensing innovation that improves camera functionality for object and facial recognition. the process of accurately measuring an object’s length, width, and height with more sophisticated equipment than is possible with a variety of existing technologies. The use of 3D technology offers distinctive improvements in how daily activities are seen and approached.
The market for 3D sensors is expected to rise over the course of the forecast period due to factors including the rising need for 3D-capable consumer gadgets and the swiftly rising demand for medical imaging solutions. Additionally, the requirement for high precision security & surveillance, the increasing need for 3D-enabled consumer electronics such as smartphones and tablets coupled with the expanding use of 3D sensing technology in virtual reality & gaming, are among the reasons boosting the market expansion.
Many of the fundamental technologies advancing 3D sensing have advantages and disadvantages. To create these new systems, it is necessary to create high-quality sensors and effective algorithms that can make use of both current and emerging technology. For instance, it is difficult to measure any surface that is outside of the scanner’s field of view since 3D sensor scanning is optical in nature. Consequently, the scanner cannot detect internal or concealed geometry, making it impossible to measure it. In order to create a full model, scans are collected from a variety of angles. Nevertheless, complicated geometry, such that is seen frequently in holes or threads, may still present a challenge.
A range of 3D-capable consumer electronics products, including cameras, 3D gaming consoles, 3D media players, 3D portable devices, 3D TV displays, 3D desktop PCs, and notebooks, have been introduced in response to the rising demand for better visual effects. As the demand for 3D-capable devices rises, so does the supply of 3D content, fueling market expansion. In order to deliver 3D sensors, Apple Inc. intends to strengthen its collaboration with Sony Corporation. As 3D sensors are frequently used in cameras, this is further propelling the market in terms of security and surveillance needs.
The COVID-19 pandemic brought several uncertainties leading to severe economic losses as various businesses across the world were at a standstill. There were import-export restrictions laid down on major 3D sensor-producing countries such as the U.S. and China, which imposed significant challenges on the market. In October 2021, the Indian government took a new initiative to produce 3D sensors from structured lite using sensor technology. Similar other initiatives are projected to relieve the obstacles of the market for any unforeseen situation.
The key players profiled in this report include pmdtechnologies ag, Infineon Technologies AG, SAMSUNG, LMI TECHNOLOGIES INC., COGNEX CORPORATION, Microchip Technology Inc., Occipital, Inc., Qualcomm Technologies, Inc., KEYENCE CORPORATION, and OmniVision Technologies, Inc.
Key Benefits For Stakeholders
●This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the 3d sensor market analysis from 2021 to 2031 to identify the prevailing 3d sensor market opportunities.
●The market research is offered along with information related to key drivers, restraints, and opportunities.
●Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
●In-depth analysis of the 3d sensor market segmentation assists to determine the prevailing market opportunities.
●Major countries in each region are mapped according to their revenue contribution to the global market.
●Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
●The report includes the analysis of the regional as well as global 3d sensor market trends, key players, market segments, application areas, and market growth strategies.
Key Market Segments
By Type
● Image Sensor
● Accelerometer Sensor
● Position Sensor
● Others
By Technology
● Structured Light
● Time of Flight
● Stereoscopic Vision
● Ultrasound
● Others
By Connectivity
● Wireless
● Wired
By End use
● Consumer Electronics
● Healthcare
● Aerospace Defense
● Automotive
● Others
By Region
● North America
○ U.S.
○ Canada
○ Mexico
● Europe
○ Germany
○ UK
○ France
○ Spain
○ Italy
○ Rest of Europe
● Asia-Pacific
○ China
○ Japan
○ India
○ South Korea
○ Australia
○ Rest Of Asia Pacific
● LAMEA
○ Brazil
○ Saudi Arabia
○ UAE
○ South Africa
○ Rest of LAMEA
● Key Market Players
○ Omnivision Technologies
○ Infineon Technologies
○ LMI Technologies
○ PrimeSense
○ Cognex Corporation
○ SoftKinetic
○ Pmdtechnologies GmbH
○ IFM Electronic
○ Occipital Inc.
❖ レポートの目次 ❖
| ★調査レポート[世界の3Dセンサー市場2021年-2031年：種類別（画像センサー、加速度計センサー、位置センサー、その他）、技術別（立体照明、タイムオブフライト、立体視、超音波、その他）、接続別（無線、有線）、エンドユーザー別（家電、医療、航空宇宙・防衛、自動車、その他）] (コード：ALD23FB037)販売に関する免責事項を必ずご確認ください。 |
| ★調査レポート[世界の3Dセンサー市場2021年-2031年：種類別（画像センサー、加速度計センサー、位置センサー、その他）、技術別（立体照明、タイムオブフライト、立体視、超音波、その他）、接続別（無線、有線）、エンドユーザー別（家電、医療、航空宇宙・防衛、自動車、その他）]についてメールでお問い合わせ |
